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公开(公告)号：US20190144995A1
公开(公告)日：2019-05-16
申请号：US16175936
申请日：2018-10-31
Applicant: SHOWA DENKO K.K.
Inventor： Naoto ISHIBASHI , Keisuke FUKADA , Yoshikazu UMETA , Tomohiro KODAMA
Abstract: A chemical vapor deposition apparatus is provided which comprises a reaction furnace in which vapor deposition is performed and an exhaust pipe which discharges a gas from an interior of the reaction furnace, wherein the exhaust pipe includes at least one of a bending part, and the bending part includes at least one of a pipe-extension part, and the pipe-extension part extends from the bending part and has a storage space in the pipe-extension part.
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