公开(公告)号：US3764422A

公开(公告)日：1973-10-09

申请号：US3764422D

申请日：1970-10-02

Applicant: SIEMENS AG

Inventor： KORITKE H ,  HAFT R

IPC: H01C17/06 ,  B23K1/00 ,  H05K1/16 ,  H05K1/18 ,  H05K3/00 ,  H05K3/34 ,  H05K5/00 ,  C23F1/02

CPC classification number: H05K5/0091 ,  B23K1/00 ,  B23K2201/36 ,  H05K1/16 ,  H05K1/167 ,  H05K1/189 ,  H05K3/3447 ,  H05K2201/10166 ,  H05K2201/105 ,  H05K2201/10568 ,  H05K2203/0165 ,  H05K2203/166 ,  H05K2203/167

Abstract: COVERS AN IMPROVED THIN LAYER ELECTRONIC CIRCUIT ASSEMBLY FOR RECEIVING ELECTRICAL COMPONENTS WHICH INCLUDES A NON-CONDUCTIVE FLEXIBLE PLASTIC FOIL SUPPORT HAVING A THINLAYER CIRCUIT ADHERENT TO SAID SUPPORT, WHICH CIRCUIT INCLUDES CONDUCTOR TRACKS FOR RECEIVING SAID ELECTRICAL COMPONENTS AND CONTACT SURFACES FOR CONNECTION WITH OTHER

CIRCUITS. IT ALSO COVERS A METHOD OF PREPARING A PLURALITY OF SAID ASSEMBLIES IN A CONTINUOUS MANNER BY PREPARING A TAPE OF SAID SUPPORT AND FIXING THEREON A PLURALTIY OF SAID THIN LAYER CIRCUITS IN A CONTINUOUS MANNER. THE TAPE THEN IS TRIMMED TO PROVIDE THE DESIRED GROUP OF CIRCUITS.