公开(公告)号：US20230223316A1

公开(公告)日：2023-07-13

申请号：US17956566

申请日：2022-09-29

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Tai-Shin Renn ,  Kuo-Hua Yu ,  Yu-Min Lo ,  Wei-Shen Hung

IPC: H01L23/367 ,  H01L23/00 ,  H01L21/48 ,  H01L25/10 ,  H01L21/56 ,  H01L23/498

CPC classification number: H01L23/3677 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L21/4853 ,  H01L25/105 ,  H01L21/568 ,  H01L21/4882 ,  H01L23/49816 ,  H01L23/49838 ,  H01L23/49833 ,  H01L2924/3511 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204

Abstract: An electronic package is provided, in which an electronic element is disposed on an upper side of a circuit structure, a package layer covers the electronic element, and an action structure is embedded in the package layer, so that the action structure is exposed from a surface of the package layer, and then a bonding element is disposed on a lower side of the circuit structure and corresponding to the position of the action structure, so as to form a thermal conduction between the bonding element and the action structure. Therefore, a laser can transfer heat energy to the bonding element via the action structure, so that a solder material on the bonding element can be reflowed.