公开(公告)号：US09786534B2

公开(公告)日：2017-10-10

申请号：US14479842

申请日：2014-09-08

Applicant: SINFONIA TECHNOLOGY CO., LTD.

Inventor： Hiroaki Nakamura ,  Toshiyuki Takaoka ,  Yoshikatsu Takemoto

IPC: H01L21/677 ,  H01L21/67

CPC classification number: H01L21/67745 ,  H01L21/67196 ,  H01L21/67766 ,  H01L21/67769

Abstract: An EFEM 1 includes a wafer transfer chamber 3 having an interior space in which a wafer transfer robot 5 is disposed and load ports 2 disposed adjacent to a front surface 32 of the wafer transfer chamber 3, and semiconductor processing equipment M can be disposed adjacent to a rear surface 33 of the wafer transfer chamber 3. The EFEM 1 has a configuration in which two buffer stations 4 capable of temporarily storing wafers W are disposed next to each other in the front-rear direction A on a side surface 31 of the wafer transfer chamber 3. The EFEM 1 thus configured adapts to an increase in wafer diameter and is capable of handling many wafers while preventing or minimizing an increase in the stroke distance in the height direction of the wafer transfer robot 5 and an increase in the footprint of the entire EFEM 1.

公开(公告)号：US20150071739A1

公开(公告)日：2015-03-12

申请号：US14479842

申请日：2014-09-08

Applicant: SINFONIA TECHNOLOGY CO., LTD.

Inventor： Hiroaki Nakamura ,  Toshiyuki Takaoka ,  Yoshikatsu Takemoto

IPC: H01L21/677

CPC classification number: H01L21/67745 ,  H01L21/67196 ,  H01L21/67766 ,  H01L21/67769

Abstract: An EFEM 1 includes a wafer transfer chamber 3 having an interior space in which a wafer transfer robot 5 is disposed and load ports 2 disposed adjacent to a front surface 32 of the wafer transfer chamber 3, and semiconductor processing equipment M can be disposed adjacent to a rear surface 33 of the wafer transfer chamber 3. The EFEM 1 has a configuration in which two buffer stations 4 capable of temporarily storing wafers W are disposed next to each other in the front-rear direction A on a side surface 31 of the wafer transfer chamber 3. The EFEM 1 thus configured adapts to an increase in wafer diameter and is capable of handling many wafers while preventing or minimizing an increase in the stroke distance in the height direction of the wafer transfer robot 5 and an increase in the footprint of the entire EFEM 1.

Abstract translation: EFEM 1包括具有设置有晶片传送机器人5的内部空间的晶片传送室3和与晶片传送室3的前表面32相邻设置的负载端口2，并且半导体处理设备M可以设置在 晶片传送室3的背面33. EFEM 1具有能够临时存储晶片W的两个缓冲站4在晶片的侧面31上沿前后方向A彼此相邻配置的结构 这样构成的EFEM 1适应于晶片直径的增加，并且能够处理许多晶片，同时防止或最小化晶片传送机器人5的高度方向上的行程距离的增加，并且增加占用面积 整个EFEM 1。