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    TRANSPORT SYSTEM
    1.
    发明申请
    TRANSPORT SYSTEM 有权

    公开(公告)号：US20220336245A1

    公开(公告)日：2022-10-20

    申请号：US17761816

    申请日：2020-09-23

    Applicant: Sinfonia Technology Co., Ltd.

    Inventor： Toshihiro Kawai ,  Hiroaki Nakamura ,  Gengoro Ogura ,  Kosuke Sugiura ,  Yasushi Taniyama

    IPC: H01L21/677 ,  B65G47/248

    Abstract: There is provided a technique capable of efficiently transporting a plurality of objects between a storage container configured to store the plurality of objects and a processing apparatus configured to collectively process the plurality of objects. A transport system 1 for transporting a plurality of objects between a storage container 9 configured to store the plurality of objects and a processing apparatus 2 configured to collectively process the plurality of objects held on a tray 8, includes: a mounting part 31 on which the storage container 9 is mounted; a stage 41 on which the plurality of objects are mounted; a tray support part 51 configured to support the tray 8; a first transport device 44 configured to transport the plurality of objects between the storage container 9 mounted on the mounting part 31 and the stage 41; and a second transport device 53 configured to transport the plurality of objects between the stage 41 and the tray 8 supported by the tray support part 51.

    EFEM
    2.
    发明授权
    EFEM 有权

    公开(公告)号：US09786534B2

    公开(公告)日：2017-10-10

    申请号：US14479842

    申请日：2014-09-08

    Applicant: SINFONIA TECHNOLOGY CO., LTD.

    Inventor： Hiroaki Nakamura ,  Toshiyuki Takaoka ,  Yoshikatsu Takemoto

    IPC: H01L21/677 ,  H01L21/67

    CPC classification number: H01L21/67745 ,  H01L21/67196 ,  H01L21/67766 ,  H01L21/67769

    Abstract: An EFEM 1 includes a wafer transfer chamber 3 having an interior space in which a wafer transfer robot 5 is disposed and load ports 2 disposed adjacent to a front surface 32 of the wafer transfer chamber 3, and semiconductor processing equipment M can be disposed adjacent to a rear surface 33 of the wafer transfer chamber 3. The EFEM 1 has a configuration in which two buffer stations 4 capable of temporarily storing wafers W are disposed next to each other in the front-rear direction A on a side surface 31 of the wafer transfer chamber 3. The EFEM 1 thus configured adapts to an increase in wafer diameter and is capable of handling many wafers while preventing or minimizing an increase in the stroke distance in the height direction of the wafer transfer robot 5 and an increase in the footprint of the entire EFEM 1.

    EFEM
    3.
    发明申请
    EFEM 有权

    公开(公告)号：US20150071739A1

    公开(公告)日：2015-03-12

    申请号：US14479842

    申请日：2014-09-08

    Applicant: SINFONIA TECHNOLOGY CO., LTD.

    Inventor： Hiroaki Nakamura ,  Toshiyuki Takaoka ,  Yoshikatsu Takemoto

    IPC: H01L21/677

    CPC classification number: H01L21/67745 ,  H01L21/67196 ,  H01L21/67766 ,  H01L21/67769

    Abstract: An EFEM 1 includes a wafer transfer chamber 3 having an interior space in which a wafer transfer robot 5 is disposed and load ports 2 disposed adjacent to a front surface 32 of the wafer transfer chamber 3, and semiconductor processing equipment M can be disposed adjacent to a rear surface 33 of the wafer transfer chamber 3. The EFEM 1 has a configuration in which two buffer stations 4 capable of temporarily storing wafers W are disposed next to each other in the front-rear direction A on a side surface 31 of the wafer transfer chamber 3. The EFEM 1 thus configured adapts to an increase in wafer diameter and is capable of handling many wafers while preventing or minimizing an increase in the stroke distance in the height direction of the wafer transfer robot 5 and an increase in the footprint of the entire EFEM 1.

    Abstract translation: EFEM 1包括具有设置有晶片传送机器人5的内部空间的晶片传送室3和与晶片传送室3的前表面32相邻设置的负载端口2，并且半导体处理设备M可以设置在 晶片传送室3的背面33. EFEM 1具有能够临时存储晶片W的两个缓冲站4在晶片的侧面31上沿前后方向A彼此相邻配置的结构 这样构成的EFEM 1适应于晶片直径的增加，并且能够处理许多晶片，同时防止或最小化晶片传送机器人5的高度方向上的行程距离的增加，并且增加占用面积 整个EFEM 1。

    Conveyance system for transferring frame wafer
    4.
    发明授权
    Conveyance system for transferring frame wafer 有权

    公开(公告)号：US11851289B2

    公开(公告)日：2023-12-26

    申请号：US17788647

    申请日：2020-09-23

    Applicant: Sinfonia Technology Co., Ltd.

    Inventor： Hiroaki Nakamura ,  Toshihiro Kawai ,  Kosuke Sugiura ,  Gengoro Ogura ,  Yasushi Taniyama

    IPC: H01L21/677 ,  B65G47/90 ,  H01L21/67 ,  H01L21/687

    CPC classification number: B65G47/905 ,  H01L21/677 ,  H01L21/67259 ,  H01L21/68707

    Abstract: A conveyance system discriminates the front and back of a frame wafer without human intervention. A frame is partially formed asymmetrically with respect to a predetermined center line when viewed in a direction orthogonal to a surface of a wafer. The conveyance system includes a hand configured to hold the frame so that the frame extends in a predetermined virtual plane, a first sensor configured to detect a portion of the frame held on the hand and located in a predetermined first region in the virtual plane, a second sensor configured to detect a portion of the frame held on the hand and located in a second region opposite to the first region across the center line, and a controller configured to determine the front and back of the frame wafer based on a detection result obtained by the first sensor and a detection result obtained by the second sensor.

    CONVEYANCE SYSTEM
    6.
    发明申请
    CONVEYANCE SYSTEM 有权

    公开(公告)号：US20230033168A1

    公开(公告)日：2023-02-02

    申请号：US17788647

    申请日：2020-09-23

    Applicant: Sinfonia Technology Co., Ltd.

    Inventor： Hiroaki Nakamura ,  Toshihiro Kawai ,  Kosuke Sugiura ,  Gengoro Ogura ,  Yasushi Taniyama

    IPC: B65G47/90 ,  H01L21/687 ,  H01L21/67 ,  H01L21/677

    Abstract: A conveyance system discriminates the front and back of a frame wafer without human intervention. A frame is partially formed asymmetrically with respect to a predetermined center line when viewed in a direction orthogonal to a surface of a wafer. The conveyance system includes a hand configured to hold the frame so that the frame extends in a predetermined virtual plane, a first sensor configured to detect a portion of the frame held on the hand and located in a predetermined first region in the virtual plane, a second sensor configured to detect a portion of the frame held on the hand and located in a second region opposite to the first region across the center line, and a controller configured to determine the front and back of the frame wafer based on a detection result obtained by the first sensor and a detection result obtained by the second sensor.

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