公开(公告)号：US20150332978A1

公开(公告)日：2015-11-19

申请号：US14807338

申请日：2015-07-23

Applicant: SINTOKOGIO, LTD.

Inventor： Kouichi INOUE ,  Kazuyoshi MAEDA ,  Norihito SHIBUYA

IPC: H01L21/66 ,  H01L21/26

CPC classification number: H01L22/12 ,  H01J37/3171 ,  H01L21/26 ,  H01L21/265 ,  H01L21/67288 ,  H01L21/6838 ,  H01L22/20 ,  H01L22/26 ,  H01L33/0095 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A warp correction apparatus includes an injection mechanism including a nozzle that performs injection treatment, an adsorption table that holds the semiconductor element substrate by adsorption at a principal surface side or a film surface side, a moving mechanism that moves the adsorption table so that the semiconductor element substrate relatively moves with respect to an injection area of an injection particle by the nozzle, an injection treatment chamber that houses the semiconductor element substrate held on the adsorption table and in the interior of which injection treatment is performed, a measurement mechanism that measures a warp of the semiconductor element substrate, and a control device that, based on a difference between a target warp amount and a warp amount measured by the measurement mechanism, performs at least either one of a setting processing of an injection treatment condition of the injection mechanism and an accept/reject determination of the semiconductor element substrate for which injection treatment has been performed.

Abstract translation: 翘曲矫正装置包括：喷射机构，其包括进行喷射处理的喷嘴;吸附台，其通过主表面侧或膜表面侧的吸附来保持半导体元件基板;移动机构，其移动吸附台，使得半导体 元件基板相对于喷嘴的注射粒子的注入区域相对移动，容纳保持在吸附台上并在其内部进行注射处理的半导体元件基板的注入处理室，测量机构 半导体元件基板的翘曲以及基于目标翘曲量与通过测量机构测量的翘曲量之差的控制装置，进行喷射机构的喷射处理条件的设定处理中的至少一个 以及半导体元件的接受/拒绝确定 已经进行了注射处理的底物。

公开(公告)号：US20230219193A1

公开(公告)日：2023-07-13

申请号：US18076614

申请日：2022-12-07

Applicant: SINTOKOGIO, LTD.

Inventor： Norihito SHIBUYA ,  Hitoshi NISHIJIMA ,  Kazuyoshi MAEDA ,  Kazumichi HIBINO ,  Souichiro NISHIO ,  Kouichi INOUE

IPC: B24C1/04

CPC classification number: B24C1/04

Abstract: A method for manufacturing a component made of a hard brittle material includes: a step of preparing a base material made of a hard brittle material; and a step of embossing the base material. A protrusion protruding in a first direction and a bottom surface surrounding the protrusion are formed on the base material by the embossing. The bottom surface extends in a plane defined by a second direction intersecting the first direction and a third direction intersecting the first direction and the second direction. The bottom surface and a side surface of the protrusion continuous with the bottom surface satisfy a relationship of z=Ax2−Bx in a cross section defined by the first direction and the second direction when the first direction is represented by z and the second direction is represented by x. A is 0.005 to 0.200 and B is 0.050 to 0.955.

公开(公告)号：US20190202029A1

公开(公告)日：2019-07-04

申请号：US16325231

申请日：2017-09-25

Applicant: SINTOKOGIO, LTD.

Inventor： Kouichi INOUE

IPC: B24C1/04 ,  B24C5/04

CPC classification number: B24C1/045 ,  B24C1/04 ,  B24C5/02 ,  B24C5/04

Abstract: In an embodiment, provided is a drilling method of Bawling a hole having a desired diameter in a fiber-reinforced plastic workpiece. The method includes disposing a resist layer, in which an opening having a diameter smaller than the desired diameter is formed, on the workpiece and ejecting blasting abrasives to the workpiece through the resist layer to cut a portion, which is exposed from the opening, in the workpiece while cutting a peripheral edge portion of the opening of the resist layer.