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    ADHERED OBJECT REMOVAL METHOD
    2.
    发明申请
    ADHERED OBJECT REMOVAL METHOD 审中-公开

    公开(公告)号：US20190160629A1

    公开(公告)日：2019-05-30

    申请号：US16323966

    申请日：2017-08-02

    Applicant: SINTOKOGIO, LTD.

    Inventor： Hitoshi NISHIJIMA ,  Norihito SHIBUYA

    IPC: B24C1/08 ,  C23C16/44 ,  H01L21/311

    Abstract: A method for removing hard adhered objects is provided whereby adhered objects adhering to a jig in a film deposition process using crystal growth are efficiently removed while reducing damage to the jig. This adhered object removal method includes a step for preparing a jetting media with a lower hardness than the jig, a step for jetting the jetting media toward the jig, and a step for forming fracture starting points at the crystal grain boundary of the adhered object when the jetting media collides with the jig, then causing further collision of jetting media to cause the adhered object to dislodge at the crystal grain boundary.

    POLISHING DEVICE AND POLISHING METHOD
    3.
    发明申请
    POLISHING DEVICE AND POLISHING METHOD 有权
    抛光装置和抛光方法

    公开(公告)号：US20160176008A1

    公开(公告)日：2016-06-23

    申请号：US14909992

    申请日：2014-03-26

    Applicant: SINTOKOGIO, LTD.

    Inventor： Kazuyoshi MAEDA ,  Norihito SHIBUYA

    IPC: B24B31/16 ,  B24C3/26 ,  B24B57/02 ,  B24B31/02 ,  B24B31/06

    CPC classification number: B24B31/16 ,  B24B31/02 ,  B24B31/06 ,  B24B57/02 ,  B24C1/08 ,  B24C3/065 ,  B24C3/26 ,  B24C7/0092 ,  H01G13/00

    Abstract: A polishing device includes a processing vessel into which workpieces are charged, a fluidizing unit that fluidizes the workpieces in the processing vessel, an abrasive-feeding unit that feeds an abrasive into the workpieces, and a suction unit that generates an air flow in a direction in which the abrasive passes through the processing vessel, and recovers the abrasive by suction. The abrasive fed from the abrasive-feeding unit is allowed to pass between the workpieces charged into the processing vessel by the air flow generated from the suction unit while coming into contact with the workpieces. Accordingly, the workpieces are polished.

    Abstract translation: 抛光装置包括：加工工件的处理容器，将处理容器中的工件流化的流化单元，将研磨剂供给到工件中的研磨给料单元;以及吸入单元，其将方向 其中磨料通过处理容器，并通过抽吸回收磨料。 从研磨给料单元供给的磨料允许通过在与工件接触的同时从吸入单元产生的气流在被加载到处理容器内的工件之间通过。 因此，抛光工件。

    METHOD FOR MANUFACTURING COMPONENT MADE OF HARD BRITTLE MATERIAL AND COMPONENT MADE OF HARD BRITTLE MATERIAL
    5.
    发明公开
    METHOD FOR MANUFACTURING COMPONENT MADE OF HARD BRITTLE MATERIAL AND COMPONENT MADE OF HARD BRITTLE MATERIAL 审中-公开

    公开(公告)号：US20230219193A1

    公开(公告)日：2023-07-13

    申请号：US18076614

    申请日：2022-12-07

    Applicant: SINTOKOGIO, LTD.

    Inventor： Norihito SHIBUYA ,  Hitoshi NISHIJIMA ,  Kazuyoshi MAEDA ,  Kazumichi HIBINO ,  Souichiro NISHIO ,  Kouichi INOUE

    IPC: B24C1/04

    CPC classification number: B24C1/04

    Abstract: A method for manufacturing a component made of a hard brittle material includes: a step of preparing a base material made of a hard brittle material; and a step of embossing the base material. A protrusion protruding in a first direction and a bottom surface surrounding the protrusion are formed on the base material by the embossing. The bottom surface extends in a plane defined by a second direction intersecting the first direction and a third direction intersecting the first direction and the second direction. The bottom surface and a side surface of the protrusion continuous with the bottom surface satisfy a relationship of z=Ax2−Bx in a cross section defined by the first direction and the second direction when the first direction is represented by z and the second direction is represented by x. A is 0.005 to 0.200 and B is 0.050 to 0.955.

    BLASTING APPARATUS AND VOLUMETRIC FEEDER
    6.
    发明申请
    BLASTING APPARATUS AND VOLUMETRIC FEEDER 有权

    公开(公告)号：US20220250208A1

    公开(公告)日：2022-08-11

    申请号：US17592816

    申请日：2022-02-04

    Applicant: SINTOKOGIO, LTD.

    Inventor： Norihito SHIBUYA ,  Kazuyoshi MAEDA

    IPC: B24C7/00 ,  B24C5/02

    Abstract: A blasting apparatus includes: a storage container including a storage chamber; a volumetric feeder; and a nozzle configured to project, together with compressed air, an abrasive supplied from the volumetric feeder, wherein: the volumetric feeder includes: a casing configured to define a space on an inside, and including an introduction port causing the space and the storage chamber to communicate with each other and a supply port opened toward a lower side in a position separated from the introduction port in a horizontal direction; and a screw including a rotational shaft housed in the casing and extending along the horizontal direction, the screw configured to carry the abrasive in the space toward the supply port from the introduction port by rotating about the rotational shaft; wherein the screw is housed in the casing in such a way as not to overlap the supply port in a vertical direction.

    CENTRIFUGAL BARREL POLISHING DEVICE AND BARREL POLISHING METHOD
    8.
    发明申请
    CENTRIFUGAL BARREL POLISHING DEVICE AND BARREL POLISHING METHOD 有权
    离心式抛光装置和棒式抛光方法

    公开(公告)号：US20160016278A1

    公开(公告)日：2016-01-21

    申请号：US14769837

    申请日：2013-10-31

    Applicant: SINTOKOGIO, LTD.

    Inventor： Kazuyoshi MAEDA ,  Norihito SHIBUYA

    IPC: B24B31/02

    CPC classification number: B24B31/0218 ,  B24B31/023 ,  B24B31/033

    Abstract: A centrifugal barrel includes a disc-like turret configured to turn about a revolution shaft, a plurality of barrel tanks each installed in the turret via a rotation shaft and configured to turn about the rotation shaft, a rotating mechanism configured to turn the turret and the barrel tanks, and a tilting mechanism configured to tilt the revolution shaft of the turret with respect to a horizontal plane and to tilt each rotation shaft with respect to the horizontal plane. By tilting each rotation shaft with respect to the horizontal plane, it is possible to prevent the workpieces from being damaged.

    Abstract translation: 一个离心桶包括一个圆盘状的转台，该转盘被构造成围绕一个转轴转动，多个筒状容器通过旋转轴安装在转台中，并被构造成围绕旋转轴转动;旋转机构，其构造成转动转台和 以及倾斜机构，其构造成相对于水平面倾斜转台的转轴并使每个旋转轴相对于水平面倾斜。 通过相对于水平面倾斜每个旋转轴，可以防止工件被损坏。

    WARP CORRECTION DEVICE AND WARP CORRECTION METHOD FOR SEMICONDUCTOR ELEMENT SUBSTRATE
    9.
    发明申请
    WARP CORRECTION DEVICE AND WARP CORRECTION METHOD FOR SEMICONDUCTOR ELEMENT SUBSTRATE 有权
    用于半导体元件基板的温度校正装置和温度校正方法

    公开(公告)号：US20150332978A1

    公开(公告)日：2015-11-19

    申请号：US14807338

    申请日：2015-07-23

    Applicant: SINTOKOGIO, LTD.

    Inventor： Kouichi INOUE ,  Kazuyoshi MAEDA ,  Norihito SHIBUYA

    IPC: H01L21/66 ,  H01L21/26

    CPC classification number: H01L22/12 ,  H01J37/3171 ,  H01L21/26 ,  H01L21/265 ,  H01L21/67288 ,  H01L21/6838 ,  H01L22/20 ,  H01L22/26 ,  H01L33/0095 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: A warp correction apparatus includes an injection mechanism including a nozzle that performs injection treatment, an adsorption table that holds the semiconductor element substrate by adsorption at a principal surface side or a film surface side, a moving mechanism that moves the adsorption table so that the semiconductor element substrate relatively moves with respect to an injection area of an injection particle by the nozzle, an injection treatment chamber that houses the semiconductor element substrate held on the adsorption table and in the interior of which injection treatment is performed, a measurement mechanism that measures a warp of the semiconductor element substrate, and a control device that, based on a difference between a target warp amount and a warp amount measured by the measurement mechanism, performs at least either one of a setting processing of an injection treatment condition of the injection mechanism and an accept/reject determination of the semiconductor element substrate for which injection treatment has been performed.

    Abstract translation: 翘曲矫正装置包括：喷射机构，其包括进行喷射处理的喷嘴;吸附台，其通过主表面侧或膜表面侧的吸附来保持半导体元件基板;移动机构，其移动吸附台，使得半导体 元件基板相对于喷嘴的注射粒子的注入区域相对移动，容纳保持在吸附台上并在其内部进行注射处理的半导体元件基板的注入处理室，测量机构 半导体元件基板的翘曲以及基于目标翘曲量与通过测量机构测量的翘曲量之差的控制装置，进行喷射机构的喷射处理条件的设定处理中的至少一个 以及半导体元件的接受/拒绝确定 已经进行了注射处理的底物。

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