公开(公告)号：US20160176008A1

公开(公告)日：2016-06-23

申请号：US14909992

申请日：2014-03-26

Applicant: SINTOKOGIO, LTD.

Inventor： Kazuyoshi MAEDA ,  Norihito SHIBUYA

IPC: B24B31/16 ,  B24C3/26 ,  B24B57/02 ,  B24B31/02 ,  B24B31/06

CPC classification number: B24B31/16 ,  B24B31/02 ,  B24B31/06 ,  B24B57/02 ,  B24C1/08 ,  B24C3/065 ,  B24C3/26 ,  B24C7/0092 ,  H01G13/00

Abstract: A polishing device includes a processing vessel into which workpieces are charged, a fluidizing unit that fluidizes the workpieces in the processing vessel, an abrasive-feeding unit that feeds an abrasive into the workpieces, and a suction unit that generates an air flow in a direction in which the abrasive passes through the processing vessel, and recovers the abrasive by suction. The abrasive fed from the abrasive-feeding unit is allowed to pass between the workpieces charged into the processing vessel by the air flow generated from the suction unit while coming into contact with the workpieces. Accordingly, the workpieces are polished.

Abstract translation: 抛光装置包括：加工工件的处理容器，将处理容器中的工件流化的流化单元，将研磨剂供给到工件中的研磨给料单元;以及吸入单元，其将方向 其中磨料通过处理容器，并通过抽吸回收磨料。 从研磨给料单元供给的磨料允许通过在与工件接触的同时从吸入单元产生的气流在被加载到处理容器内的工件之间通过。 因此，抛光工件。

公开(公告)号：US20170259401A1

公开(公告)日：2017-09-14

申请号：US15528548

申请日：2015-10-29

Applicant: SINTOKOGIO, LTD.

Inventor： Kazuyoshi MAEDA ,  Norihito SHIBUYA

IPC: B24C9/00 ,  B24C3/20 ,  B24C1/08

CPC classification number: B24C9/003 ,  B24C1/08 ,  B24C3/20 ,  B24C3/26 ,  B24C3/32 ,  B24C5/00 ,  B24C9/00

Abstract: A polishing method includes: a step of preparing a polishing device including a processing member and a suction mechanism configured to generate suction force; a step of setting a workpiece in the processing member; and a step of accelerating abrasive grains fed toward the workpiece to a predetermined speed with an air flow generated by operation of the suction mechanism, and polishing the workpiece by causing the abrasive grains to contact with or collide with the workpiece.

公开(公告)号：US20160016278A1

公开(公告)日：2016-01-21

申请号：US14769837

申请日：2013-10-31

Applicant: SINTOKOGIO, LTD.

Inventor： Kazuyoshi MAEDA ,  Norihito SHIBUYA

IPC: B24B31/02

CPC classification number: B24B31/0218 ,  B24B31/023 ,  B24B31/033

Abstract: A centrifugal barrel includes a disc-like turret configured to turn about a revolution shaft, a plurality of barrel tanks each installed in the turret via a rotation shaft and configured to turn about the rotation shaft, a rotating mechanism configured to turn the turret and the barrel tanks, and a tilting mechanism configured to tilt the revolution shaft of the turret with respect to a horizontal plane and to tilt each rotation shaft with respect to the horizontal plane. By tilting each rotation shaft with respect to the horizontal plane, it is possible to prevent the workpieces from being damaged.

Abstract translation: 一个离心桶包括一个圆盘状的转台，该转盘被构造成围绕一个转轴转动，多个筒状容器通过旋转轴安装在转台中，并被构造成围绕旋转轴转动;旋转机构，其构造成转动转台和 以及倾斜机构，其构造成相对于水平面倾斜转台的转轴并使每个旋转轴相对于水平面倾斜。 通过相对于水平面倾斜每个旋转轴，可以防止工件被损坏。

公开(公告)号：US20150332978A1

公开(公告)日：2015-11-19

申请号：US14807338

申请日：2015-07-23

Applicant: SINTOKOGIO, LTD.

Inventor： Kouichi INOUE ,  Kazuyoshi MAEDA ,  Norihito SHIBUYA

IPC: H01L21/66 ,  H01L21/26

CPC classification number: H01L22/12 ,  H01J37/3171 ,  H01L21/26 ,  H01L21/265 ,  H01L21/67288 ,  H01L21/6838 ,  H01L22/20 ,  H01L22/26 ,  H01L33/0095 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A warp correction apparatus includes an injection mechanism including a nozzle that performs injection treatment, an adsorption table that holds the semiconductor element substrate by adsorption at a principal surface side or a film surface side, a moving mechanism that moves the adsorption table so that the semiconductor element substrate relatively moves with respect to an injection area of an injection particle by the nozzle, an injection treatment chamber that houses the semiconductor element substrate held on the adsorption table and in the interior of which injection treatment is performed, a measurement mechanism that measures a warp of the semiconductor element substrate, and a control device that, based on a difference between a target warp amount and a warp amount measured by the measurement mechanism, performs at least either one of a setting processing of an injection treatment condition of the injection mechanism and an accept/reject determination of the semiconductor element substrate for which injection treatment has been performed.

Abstract translation: 翘曲矫正装置包括：喷射机构，其包括进行喷射处理的喷嘴;吸附台，其通过主表面侧或膜表面侧的吸附来保持半导体元件基板;移动机构，其移动吸附台，使得半导体 元件基板相对于喷嘴的注射粒子的注入区域相对移动，容纳保持在吸附台上并在其内部进行注射处理的半导体元件基板的注入处理室，测量机构 半导体元件基板的翘曲以及基于目标翘曲量与通过测量机构测量的翘曲量之差的控制装置，进行喷射机构的喷射处理条件的设定处理中的至少一个 以及半导体元件的接受/拒绝确定 已经进行了注射处理的底物。

公开(公告)号：US20230219193A1

公开(公告)日：2023-07-13

申请号：US18076614

申请日：2022-12-07

Applicant: SINTOKOGIO, LTD.

Inventor： Norihito SHIBUYA ,  Hitoshi NISHIJIMA ,  Kazuyoshi MAEDA ,  Kazumichi HIBINO ,  Souichiro NISHIO ,  Kouichi INOUE

IPC: B24C1/04

CPC classification number: B24C1/04

Abstract: A method for manufacturing a component made of a hard brittle material includes: a step of preparing a base material made of a hard brittle material; and a step of embossing the base material. A protrusion protruding in a first direction and a bottom surface surrounding the protrusion are formed on the base material by the embossing. The bottom surface extends in a plane defined by a second direction intersecting the first direction and a third direction intersecting the first direction and the second direction. The bottom surface and a side surface of the protrusion continuous with the bottom surface satisfy a relationship of z=Ax2−Bx in a cross section defined by the first direction and the second direction when the first direction is represented by z and the second direction is represented by x. A is 0.005 to 0.200 and B is 0.050 to 0.955.

公开(公告)号：US20220250208A1

公开(公告)日：2022-08-11

申请号：US17592816

申请日：2022-02-04

Applicant: SINTOKOGIO, LTD.

Inventor： Norihito SHIBUYA ,  Kazuyoshi MAEDA

IPC: B24C7/00 ,  B24C5/02

Abstract: A blasting apparatus includes: a storage container including a storage chamber; a volumetric feeder; and a nozzle configured to project, together with compressed air, an abrasive supplied from the volumetric feeder, wherein: the volumetric feeder includes: a casing configured to define a space on an inside, and including an introduction port causing the space and the storage chamber to communicate with each other and a supply port opened toward a lower side in a position separated from the introduction port in a horizontal direction; and a screw including a rotational shaft housed in the casing and extending along the horizontal direction, the screw configured to carry the abrasive in the space toward the supply port from the introduction port by rotating about the rotational shaft; wherein the screw is housed in the casing in such a way as not to overlap the supply port in a vertical direction.