Abstract:
A semiconductor apparatus includes a first memory die; a second memory die; and a processor configured to provide an external command, an external start address and an external end address which are associated with a read operation, to the first memory die, and provide an external command, an external start address and an external end address, which are associated with a write operation, to the second memory die, in the case where data stored in the first memory die is to be transferred to and stored in the second memory die.
Abstract:
A memory system includes a memory device and a memory controller. The memory device includes a plurality of memory dies having different page sizes. The memory controller generates a plurality of chip selection signals for activating the plurality of memory dies based on the reordering number of requests received from a processor.
Abstract:
A processing-in-memory (PIM)-based accelerating device includes a plurality of PIM devices, a PIM network system configured to control traffic of signals and data for the plurality of PIM devices, and a first interface configured to perform interfacing with a host device. The PIM network system controls the traffic so that the plurality of PIM devices perform different operations, the plurality of PIM devices perform different operations in groups, or the plurality of PIM devices perform the same operation in parallel.
Abstract:
A memory system includes a memory unit and a memory controller. The memory unit includes a plurality of memory banks, wherein an information stored in a memory bank is accessed via a word line and a bit line. The memory controller is configured to limit repetitive accessing of a same word line or a same bit line so that the number of consecutive access is less than a predetermined critical value.
Abstract:
A semiconductor memory apparatus includes a test circuit configured to receive a plurality of sequentially-changing test input patterns, compress the received test input patterns at each clock signal, and output the compressed patterns as variable test data.
Abstract:
Disclosed is a semiconductor device including an ECC circuit for improving error correction capability. A semiconductor device in accordance with an embodiment of the present invention includes a memory region configured to include a plurality of banks and a redundancy region within each of the banks and an error check and correction (ECC) region configured to detect an address of the memory region at which an error has occurred and correct a defect of the memory region by replacing the address at which the error has occurred with a redundancy line of the redundancy region based on address information.
Abstract:
A memory system includes a processor and a plurality of memories. The processor includes a plurality of ECCs having different error restoration rates with each other, and a plurality of memories is coupled to the plurality of ECCs, respectively, according to distances from the processor.