公开(公告)号：US20130133957A1

公开(公告)日：2013-05-30

申请号：US13684613

申请日：2012-11-26

Applicant: SMITH INTERNATIONAL, INC.

Inventor： J. DANIEL BELNAP ,  GEORGIY VORONIN ,  PETER T. CARIVEAU

IPC: E21B10/46 ,  B24D3/06

CPC classification number: B24D3/06 ,  B24D18/0009 ,  B24D99/005 ,  E21B10/46 ,  E21B10/567 ,  E21B10/573

Abstract: A cutting element having a substrate, an abrasive layer mounted to the substrate at an interface, and a longitudinal axis extending through the abrasive layer and the substrate is disclosed, wherein the substrate has a binder material, a plurality of metal carbide grains bonded together by an amount of the binder material, and at least one binder gradient, and wherein the amount of binder material decreases along at least one direction to form the at least one binder gradient.

Abstract translation: 公开了一种切割元件，其具有基底，在界面处安装到基底的研磨层和延伸穿过研磨层和基底的纵向轴线，其中所述基底具有粘合剂材料，多个金属碳化物颗粒通过 粘合剂材料的量和至少一种粘合剂梯度，并且其中粘合剂材料的量沿着至少一个方向减小以形成至少一种粘合剂梯度。

公开(公告)号：US20140290146A1

公开(公告)日：2014-10-02

申请号：US14301906

申请日：2014-06-11

Applicant: SMITH INTERNATIONAL, INC.

Inventor： GUOJIANG FAN ,  FENG YU ,  YI FANG ,  J. DANIEL BELNAP ,  PETER T. CARIVEAU

IPC: B24D18/00

CPC classification number: B24D18/0027 ,  B24D18/0009 ,  B24D99/005 ,  E21B10/36 ,  E21B10/55 ,  E21B10/567

Abstract: A method for facilitating infiltration of an infiltrant material into a TSP material during re-bonding of the TSP material to a substrate, by enhancing the porosity of the TSP material near the interface with the substrate is provided. Cutting elements formed by such method and downhole tools including such cutting elements are also provided.

Abstract translation: 提供了一种通过增加TSP材料在与衬底界面附近的孔隙率的方法，使TSP材料在将TSP材料重新接合到衬底期间渗透到TSP材料中的方法。 还提供了由这种方法形成的切割元件和包括这种切割元件的井下工具。

公开(公告)号：US20140013671A1

公开(公告)日：2014-01-16

申请号：US14028328

申请日：2013-09-16

Applicant: SMITH INTERNATIONAL, INC.

Inventor： J. DANIEL BELNAP ,  GEORGIY VORONIN ,  FENG YU ,  PETER T. CARIVEAU ,  YOUHE ZHANG ,  YUELIN SHEN ,  GUODONG ZHAN

IPC: B24D3/10

CPC classification number: E21B10/55 ,  B01J3/062 ,  B01J2203/062 ,  B01J2203/0655 ,  B01J2203/0685 ,  B22F2003/244 ,  B22F2005/001 ,  B22F2998/10 ,  B22F2999/00 ,  B24D3/10 ,  C22C26/00 ,  C22C2026/006 ,  E21B10/567 ,  E21B10/5735 ,  B22F7/062 ,  B22F3/14 ,  B22F2207/01 ,  B22F2207/13 ,  B22F2207/17

Abstract: The present disclosure relates to cutting elements incorporating polycrystalline diamond bodies used for subterranean drilling applications, and more particularly, to polycrystalline diamond bodies having a high diamond content which are configured to provide improved properties of thermal stability and wear resistance, while maintaining a desired degree of impact resistance, when compared to prior polycrystalline diamond bodies. In various embodiments disclosed herein, a cutting element with high diamond content includes a modified PCD structure and/or a modified interface (between the PCD body and a substrate), to provide superior performance.