中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

4 records (took 0.02 seconds)

    ULTRA-HARD CONSTRUCTIONS WITH EROSION RESISTANCE
    1.
    发明申请
    ULTRA-HARD CONSTRUCTIONS WITH EROSION RESISTANCE 审中-公开
    具有耐腐蚀性的超硬结构

    公开(公告)号：US20140069725A1

    公开(公告)日：2014-03-13

    申请号：US14019394

    申请日：2013-09-05

    Applicant: Smith International, Inc.

    Inventor： FENG YU ,  BENJAMIN RANDALL ,  HAIBO ZHANG ,  J. DANIEL BELNAP

    IPC: E21B10/573 ,  E21B10/55

    CPC classification number: E21B10/5735 ,  B22F3/15 ,  B22F7/062 ,  B22F2005/001 ,  B22F2999/00 ,  C22C26/00 ,  E21B10/46 ,  E21B10/55 ,  B22F2303/35

    Abstract: Ultra-hard constructions comprise polycrystalline diamond-body having a first metallic substrate attached thereto, and having a second metallic substrate attached to the first metallic substrate. The first and second substrates each comprise a first hard particle phase, e.g., WC, and a second binder material phase, e.g., Co, wherein the hard particles in the second substrate are sized larger than those in the first substrate. The first substrate may contain a larger amount of binder material than the second substrate. Constructed in this matter, the first substrate is engineered to facilitate sintering diamond body during HPHT conditions, while the second substrate is engineered to provide an improved degree of erosion resistance when placed in an end-use application. The construction may be formed during a single HPHT process. The second substrate may comprise 80 percent or more of the combined thickness of the first and second substrates.

    Abstract translation: 超硬结构包括具有附接到其上的第一金属基底的多晶金刚石体，并且具有附接到第一金属基底的第二金属基底。 第一和第二基底各自包含第一硬质颗粒相，例如WC和第二粘合剂材料相，例如Co，其中第二基底中的硬颗粒的尺寸大于第一基底中的那些。 第一基底可以含有比第二基底更大量的粘合剂材料。 在这个问题上构建，第一个基板被设计成便于在HPHT条件下烧结金刚石体，而第二个基底被设计成当放置在终端应用中时提供改善的抗侵蚀性。 该结构可以在单个HPHT过程中形成。 第二基板可以包括第一和第二基板的组合厚度的80％或更多。

    ULTRA-HARD MATERIAL CUTTING ELEMENTS, METHODS OF FORMING THE SAME AND BITS INCORPORATING THE SAME
    3.
    发明申请
    ULTRA-HARD MATERIAL CUTTING ELEMENTS, METHODS OF FORMING THE SAME AND BITS INCORPORATING THE SAME 审中-公开
    超硬材料切割元件，其形成方法和包含其的位置

    公开(公告)号：US20140110180A1

    公开(公告)日：2014-04-24

    申请号：US13837609

    申请日：2013-03-15

    Applicant: SMITH INTERNATIONAL, INC.

    Inventor： FENG YU

    IPC: E21B10/573 ,  E21B10/50 ,  B24D18/00 ,  E21B10/55

    CPC classification number: E21B10/5735 ,  B28D1/146 ,  E21B10/42 ,  E21B10/46 ,  E21B10/55 ,  E21B10/62 ,  E21B2010/563 ,  E21B2010/565

    Abstract: The present disclosure relates to cutting tools incorporating polycrystalline diamond bodies used for subterranean drilling applications, and more particularly, to a polycrystalline diamond body joined to a substrate by a fastening member to form a cutting element. The polycrystalline diamond body may be binderless polycrystalline diamond, non-metal catalyst polycrystalline diamond, leached polycrystalline diamond, carbonate polycrystalline diamond or polycrystalline cubic boron nitride. The polycrystalline diamond body includes an aperture and a fastening member extending through the aperture and metallurgically bonded to the substrate by a HPHT process.

    Abstract translation: 本公开涉及结合用于地下钻井应用的多晶金刚石体的切割工具，更具体地，涉及通过紧固构件连接到基底以形成切割元件的多晶金刚石体。 多晶金刚石体可以是无粘结剂多晶金刚石，非金属催化剂多晶金刚石，浸出多晶金刚石，碳酸盐多晶金刚石或多晶立方氮化硼。 多晶金刚石体包括孔和穿过孔延伸的紧固构件，并通过HPHT方法冶金结合到衬底。

Patent Agency Ranking