SOLID-STATE IMAGING APPARATUS, MANUFACTURING METHOD THEREFOR, AND ELECTRONIC APPARATUS
    1.
    发明申请
    SOLID-STATE IMAGING APPARATUS, MANUFACTURING METHOD THEREFOR, AND ELECTRONIC APPARATUS 有权
    固态成像装置及其制造方法及电子装置

    公开(公告)号:US20160204153A1

    公开(公告)日:2016-07-14

    申请号:US14912659

    申请日:2014-08-15

    Inventor: Hiroshi TAYANAKA

    Abstract: The present technology relates to a solid-state imaging apparatus, a manufacturing method therefor, and an electronic apparatus by which fine pixel signals can be suitably generated.A charge accumulation section that is formed on a first semiconductor substrate and accumulates photoelectrically converted charges, a charge-retaining section that is formed on a second semiconductor substrate and retains charges accumulated in the charge accumulation section, and a transfer transistor that is formed on the first semiconductor substrate and the second semiconductor substrate and transfers charges accumulated in the charge accumulation section to the charge-retaining section are provided. A bonding interface between the first semiconductor substrate and the second semiconductor substrate is formed in a channel of the transfer transistor.

    Abstract translation: 本技术涉及一种固态成像装置及其制造方法以及可适当地产生精细像素信号的电子装置。 一种形成在第一半导体衬底上并累积光电转换电荷的电荷累积部分,形成在第二半导体衬底上并保持蓄积在电荷累积部分中的电荷的电荷保持部分,以及形成在第二半导体衬底上的转移晶体管 第一半导体衬底和第二半导体衬底,并且将积累在电荷累积部分中的电荷转移到电荷保持部分。 第一半导体衬底和第二半导体衬底之间的结合界面形成在转移晶体管的沟道中。

Patent Agency Ranking