公开(公告)号：US20200321380A1

公开(公告)日：2020-10-08

申请号：US16909372

申请日：2020-06-23

Applicant: SONY CORPORATION

Inventor： Taizo TAKACHI

IPC: H01L27/146 ,  H01L27/14

Abstract: The present technology relates to an image sensor, a manufacturing method and an electronic device capable of preventing a ghost. In the image sensor, a plate-like transparent member larger than a sensor chip in size is affixed to a side of a pixel array unit of the sensor chip having the pixel array unit in which pixels that perform photoelectric conversion are arrayed. The present technology can be applied to a case of capturing an image by receiving light, regardless of whether the light is visible light or not.

公开(公告)号：US20190019831A1

公开(公告)日：2019-01-17

申请号：US16069848

申请日：2017-01-11

Applicant: SONY CORPORATION

Inventor： Taizo TAKACHI

IPC: H01L27/146

Abstract: The present technology relates to an image sensor, a manufacturing method and an electronic device capable of preventing a ghost. In the image sensor, a plate-like transparent member larger than a sensor chip in size is affixed to a side of a pixel array unit of the sensor chip having the pixel array unit in which pixels that perform photoelectric conversion are arrayed. The present technology can be applied to a case of capturing an image by receiving light, regardless of whether the light is visible light or not.

公开(公告)号：US20190013341A1

公开(公告)日：2019-01-10

申请号：US16113886

申请日：2018-08-27

Applicant: Sony Corporation

Inventor： Satoru WAKIYAMA ,  Taizo TAKACHI

IPC: H01L27/146 ,  H01L31/18 ,  H01L31/041 ,  H01L31/0216

CPC classification number: H01L27/14618 ,  H01L27/14632 ,  H01L27/14685 ,  H01L31/02165 ,  H01L31/041 ,  H01L31/18 ,  H01L2224/13 ,  H01L2224/94 ,  Y02E10/50

Abstract: A method of manufacturing a semiconductor device includes: forming, on a cover glass, a film having a predetermined specific gravity and configured to shield an alpha ray that arises from the cover glass; and bonding the cover glass on which the film is formed and an image pickup device, by filling a transparent resin between the cover glass and the image pickup device.

公开(公告)号：US20170186791A1

公开(公告)日：2017-06-29

申请号：US15454560

申请日：2017-03-09

Applicant: SONY CORPORATION

Inventor： Satoru WAKIYAMA ,  Taizo TAKACHI

IPC: H01L27/146 ,  H01L31/041 ,  H01L31/0216

CPC classification number: H01L31/02165 ,  H01L27/14618 ,  H01L27/14632 ,  H01L27/14685 ,  H01L31/041 ,  H01L31/18 ,  H01L2224/13 ,  H01L2224/94 ,  Y02E10/50

Abstract: A method of manufacturing a semiconductor device includes: forming, on a cover glass, a film having a predetermined specific gravity and configured to shield an alpha ray that arises from the cover glass; and bonding the cover glass on which the film is formed and an image pickup device, by filling a transparent resin between the cover glass and the image pickup device.

公开(公告)号：US20140252526A1

公开(公告)日：2014-09-11

申请号：US14189068

申请日：2014-02-25

Applicant: Sony Corporation

Inventor： Satoru WAKIYAMA ,  Taizo TAKACHI

IPC: H01L31/0216 ,  H01L31/18

CPC classification number: H01L31/02165 ,  H01L27/14618 ,  H01L27/14632 ,  H01L27/14685 ,  H01L31/041 ,  H01L31/18 ,  H01L2224/13 ,  H01L2224/94 ,  Y02E10/50

Abstract: A method of manufacturing a semiconductor device includes: forming, on a cover glass, a film having a predetermined specific gravity and configured to shield an alpha ray that arises from the cover glass; and bonding the cover glass on which the film is formed and an image pickup device, by filling a transparent resin between the cover glass and the image pickup device.

Abstract translation: 一种制造半导体器件的方法包括：在覆盖玻璃上形成具有预定比重的膜并构造成屏蔽由玻璃罩产生的α射线; 以及通过在透明树脂之间填充在所述盖玻璃和所述图像拾取装置之间来粘结其上形成有所述膜的所述盖玻片和图像拾取装置。