公开(公告)号：US20180166490A1

公开(公告)日：2018-06-14

申请号：US15553326

申请日：2016-02-26

Applicant: SONY CORPORATION

Inventor： Satoru WAKIYAMA ,  Yukio TAGAWA

IPC: H01L27/146 ,  H01L23/48 ,  H01L23/00

CPC classification number: H01L27/14634 ,  H01L21/76898 ,  H01L23/481 ,  H01L24/05 ,  H01L24/16 ,  H01L27/14618 ,  H01L27/14621 ,  H01L27/14623 ,  H01L27/14627 ,  H01L27/14636 ,  H01L27/1464 ,  H01L27/14685 ,  H01L27/1469 ,  H01L2224/05082 ,  H01L2224/05147 ,  H01L2224/05181 ,  H01L2224/05647 ,  H01L2224/16146 ,  H01L2224/73204

Abstract: There is provided an imaging device including: a first semiconductor substrate (21) having a first region (22, R11) that includes a photoelectric conversion section (67) and a via portion (51), a second region (R12) adjacent to the first region, a connection portion (53, 84, 85) disposed at the second region, and a second semiconductor substrate (81), wherein the connection portion electrically couples the first semiconductor substrate to the second semiconductor substrate in a stacked configuration, and wherein a width of the connection portion is greater than a width of the via portion.