公开(公告)号：US20240186171A1

公开(公告)日：2024-06-06

申请号：US18396397

申请日：2023-12-26

Applicant: SPTS TECHNOLOGIES LIMITED

Inventor： Nicolas LAUNAY

IPC: H01L21/683 ,  H01J37/32 ,  H01L21/3065 ,  H01L21/67

CPC classification number: H01L21/6833 ,  H01J37/32724 ,  H01L21/3065 ,  H01L21/67069 ,  H01L21/67103 ,  H01J2237/002 ,  H01J2237/2007 ,  H01J2237/334

Abstract: A substrate support includes an electrostatic chuck having an upper surface, and a cover positioned on the electrostatic chuck to cover the upper surface thereof. The cover includes a first face adjacent the upper surface of the electrostatic chuck, a second face for supporting a substrate, and one or more conduits extending through the cover to permit a cooling gas to flow from the second face to the first face. The cover is made from a dielectric material.