INTEGRATED VACUUM CELL ASSEMBLIES

    公开(公告)号:US20230049199A1

    公开(公告)日:2023-02-16

    申请号:US17758930

    申请日:2020-10-07

    Abstract: The disclosure describes vacuum cell assemblies that integrate a vacuum envelope with a photonic integrated circuit (PIC). Walls of the vacuum envelope are coupled to the PIC, such as through anodic bonding, so that the PIC forms at least one wall of the vacuum envelope and provides an optically accessible medium and surface for transmitting and distributing light into various cavities of the vacuum envelope through one or more nonplanar waveguides. A surface of the PIC may include a material that is compatible with a material of the walls of the vacuum envelope, such as a silicon-based vacuum envelope bonded to a silicon nitride or amorphous silicon surface of the PIC. Each waveguide may include a bridge structure that forms a planar surface for tightly bonding with the vacuum envelope and preserves properties of the transmitted light between opposing sections of the waveguide.

    QUANTUM ELECTROMAGNETIC FIELD SENSOR
    2.
    发明公开

    公开(公告)号:US20240310422A1

    公开(公告)日:2024-09-19

    申请号:US18577054

    申请日:2022-07-06

    CPC classification number: G01R29/0885

    Abstract: In one example, a sensor comprising a vapor cell including a vapor of alkali atoms is disclosed. The sensor further comprises a system configured to direct electromagnetic (EM) radiation of one or more frequencies into the vapor cell and incident on the vapor of alkali atoms. The EM radiation of one or more frequencies is configured to prepare the alkali atoms from a first quantum state to a Rydberg state. The alkali atoms prepared in the Rydberg state comprise an orbital angular momentum quantum number that is at least the number of quanta of the one or more frequencies. The sensor further comprises a detector configured to detect a response of the alkali atoms to incident electromagnetic radiation after the alkali atoms are prepared in the Rydberg state.

    LOW POWER ATOMIC SENSOR
    3.
    发明公开

    公开(公告)号:US20230296380A1

    公开(公告)日:2023-09-21

    申请号:US18041053

    申请日:2020-08-13

    CPC classification number: G01C19/62 G01R33/26

    Abstract: An assembly includes one or more high temperature vapor cells positioned along an axis of the assembly, a vacuum envelope encasing the one or more high temperature vapor cells, and one or more sets of low thermal conductivity mounting structures coupled to the vacuum envelope. Each set of low thermal conductivity mounting structures is configured to position a corresponding one of the high temperature vapor cells within the vacuum envelope.

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