公开(公告)号：US20230296380A1

公开(公告)日：2023-09-21

申请号：US18041053

申请日：2020-08-13

Applicant: SRI International

Inventor： Sterling Eduardo McBride ,  Alan M. Braun ,  Seth Charles Caliga

IPC: G01C19/62 ,  G01R33/26

CPC classification number: G01C19/62 ,  G01R33/26

Abstract: An assembly includes one or more high temperature vapor cells positioned along an axis of the assembly, a vacuum envelope encasing the one or more high temperature vapor cells, and one or more sets of low thermal conductivity mounting structures coupled to the vacuum envelope. Each set of low thermal conductivity mounting structures is configured to position a corresponding one of the high temperature vapor cells within the vacuum envelope.

公开(公告)号：US11549811B2

公开(公告)日：2023-01-10

申请号：US17251101

申请日：2019-06-13

Applicant: SRI International

Inventor： Seth Charles Caliga

IPC: G01C19/62 ,  G01C19/72 ,  G01P15/08

Abstract: An embodiment of an integrated atom chip used for measuring atoms is discussed. One or more magnetic traps integrated with an optical waveguide that is imprinted onto the integrated atom chip facilitate loading of the atoms into an evanescent field optical trap of the optical waveguide in order to measure the atoms. The two or more stages of cooling are used to progressively cool the atoms from an initial temperature down to a final temperature of the atoms when mode matched and loaded into the evanescent field optical trap of the optical waveguide.

公开(公告)号：US20230049199A1

公开(公告)日：2023-02-16

申请号：US17758930

申请日：2020-10-07

Applicant: SRI International

Inventor： Sterling Eduardo McBride ,  Joey J. Michalchuk ,  Seth Charles Caliga ,  Alan M. Braun

IPC: G02B6/122

Abstract: The disclosure describes vacuum cell assemblies that integrate a vacuum envelope with a photonic integrated circuit (PIC). Walls of the vacuum envelope are coupled to the PIC, such as through anodic bonding, so that the PIC forms at least one wall of the vacuum envelope and provides an optically accessible medium and surface for transmitting and distributing light into various cavities of the vacuum envelope through one or more nonplanar waveguides. A surface of the PIC may include a material that is compatible with a material of the walls of the vacuum envelope, such as a silicon-based vacuum envelope bonded to a silicon nitride or amorphous silicon surface of the PIC. Each waveguide may include a bridge structure that forms a planar surface for tightly bonding with the vacuum envelope and preserves properties of the transmitted light between opposing sections of the waveguide.

公开(公告)号：US20210190496A1

公开(公告)日：2021-06-24

申请号：US17251101

申请日：2019-06-13

Applicant: SRI International

Inventor： Seth Charles Caliga

IPC: G01C19/62 ,  G01C19/72 ,  G01P15/08

Abstract: An embodiment of an integrated atom chip used for measuring atoms is discussed. One or more magnetic traps integrated with an optical waveguide that is imprinted onto the integrated atom chip facilitate loading of the atoms into an evanescent field optical trap of the optical waveguide in order to measure the atoms. The two or more stages of cooling are used to progressively cool the atoms from an initial temperature down to a final temperature of the atoms when mode matched and loaded into the evanescent field optical trap of the optical waveguide.