公开(公告)号：US11569077B2

公开(公告)日：2023-01-31

申请号：US16629528

申请日：2018-07-11

Applicant: SRI International

Inventor： Sterling Eduardo McBride ,  Joey J. Michalchuk ,  Christopher E. Holland ,  Ashish Chaudhary ,  Winston K. Chan

IPC: H01J41/20 ,  F04B37/14 ,  H01J41/12 ,  H01J9/02 ,  H01J1/304 ,  H01J41/00 ,  H01J1/30 ,  H01J41/14 ,  H01J41/16 ,  H01J41/04 ,  H02K44/00 ,  B03C3/40 ,  G01L21/34 ,  F04B37/02 ,  B03C3/41

Abstract: The disclosure includes an outer electrode and an inner electrode. The outer electrode defines an inner volume and is configured to receive injected electrons through at least one aperture. The inner electrode positioned in the inner volume. The outer electrode and inner electrode are configured to confine the received electrons in orbits around the inner electrode in response to an electric potential between the outer electrode and the inner electrode. The apparatus does not include a component configured to generate an electron-confining magnetic field.

公开(公告)号：US20230049199A1

公开(公告)日：2023-02-16

申请号：US17758930

申请日：2020-10-07

Applicant: SRI International

Inventor： Sterling Eduardo McBride ,  Joey J. Michalchuk ,  Seth Charles Caliga ,  Alan M. Braun

IPC: G02B6/122

Abstract: The disclosure describes vacuum cell assemblies that integrate a vacuum envelope with a photonic integrated circuit (PIC). Walls of the vacuum envelope are coupled to the PIC, such as through anodic bonding, so that the PIC forms at least one wall of the vacuum envelope and provides an optically accessible medium and surface for transmitting and distributing light into various cavities of the vacuum envelope through one or more nonplanar waveguides. A surface of the PIC may include a material that is compatible with a material of the walls of the vacuum envelope, such as a silicon-based vacuum envelope bonded to a silicon nitride or amorphous silicon surface of the PIC. Each waveguide may include a bridge structure that forms a planar surface for tightly bonding with the vacuum envelope and preserves properties of the transmitted light between opposing sections of the waveguide.

公开(公告)号：US11688638B2

公开(公告)日：2023-06-27

申请号：US16497113

申请日：2018-03-27

Applicant: SRI International

Inventor： Winston K. Chan ,  Joey J. Michalchuk

IPC: H01L21/683 ,  H01L21/78 ,  B32B43/00 ,  C09J9/02 ,  C09J11/04 ,  C09J191/06 ,  H01L21/67 ,  H01L29/06 ,  C08K3/08

CPC classification number: H01L21/78 ,  B32B43/006 ,  C09J9/02 ,  C09J11/04 ,  C09J191/06 ,  H01L21/67092 ,  H01L21/6835 ,  H01L29/0657 ,  C08K2003/085 ,  C08K2003/0806 ,  C08K2003/0831 ,  C08K2201/001 ,  H01L2221/68327 ,  H01L2221/68381

Abstract: A system to manufacture a plurality of dies may include an etching tool, an electrically-conductive-adhesive-composition, a heat-applying-extraction-tool and a porous substrate cooperating with an evacuation component. The etching tool uses an ion beam that is configured to singulate a plurality of dies on a wafer with an ion etching process. The electrically-conductive-adhesive-composition is located between the wafer and a porous substrate carrying the wafer during the ion etching process. The electrically-conductive-adhesive-composition adheres the wafer to the porous substrate to keep the dies in place during the ion etching process. The electrically-conductive-adhesive-composition also aids in conducting electrons away from the wafer as a drain during the ion etching process. The heat-applying-extraction-tool applies heat to an individual die during a handling process of the manufacturing process in order to melt the electrically-conductive-adhesive-composition through the porous substrate to an evacuation component in order to then pick up an individual die singulated from the wafer.

公开(公告)号：US20210125867A1

公开(公告)日：2021-04-29

申请号：US16497113

申请日：2018-03-27

Applicant: SRI International

Inventor： Winston K. Chan ,  Joey J. Michalchuk

IPC: H01L21/78 ,  H01L21/67 ,  H01L21/683 ,  H01L29/06 ,  C09J191/06 ,  C09J11/04 ,  C09J9/02 ,  B32B43/00

Abstract: A system to manufacture a plurality of dies may include an etching tool, an electrically-conductive-adhesive-composition, a heat-applying-extraction-tool and a porous substrate cooperating with an evacuation component. The etching tool uses an ion beam that is configured to singulate a plurality of dies on a wafer with an ion etching process. The electrically-conductive-adhesive-composition is located between the wafer and a porous substrate carrying the wafer during the ion etching process. The electrically-conductive-adhesive-composition adheres the wafer to the porous substrate to keep the dies in place during the ion etching process. The electrically-conductive-adhesive-composition also aids in conducting electrons away from the wafer as a drain during the ion etching process. The heat-applying-extraction-tool applies heat to an individual die during a handling process of the manufacturing process in order to melt the electrically-conductive-adhesive-composition through the porous substrate to an evacuation component in order to then pick up an individual die singulated from the wafer.

公开(公告)号：US20200343081A1

公开(公告)日：2020-10-29

申请号：US16629528

申请日：2018-07-11

Applicant: SRI International

Inventor： Sterling Eduardo McBride ,  Joey J. Michalchuk ,  Christopher E. Holland ,  Ashish Chaudhary ,  Winston K. Chan

IPC: H01J41/20 ,  F04B37/14

Abstract: The disclosure includes an outer electrode and an inner electrode. The outer electrode defines an inner volume and is configured to receive injected electrons through at least one aperture. The inner electrode positioned in the inner volume. The outer electrode and inner electrode are configured to confine the received electrons in orbits around the inner electrode in response to an electric potential between the outer electrode and the inner electrode. The apparatus does not include a component configured to generate an electron-confining magnetic field.