公开(公告)号：US20200166802A1

公开(公告)日：2020-05-28

申请号：US16615242

申请日：2018-05-22

Applicant: STANLEY ELECTRIC CO., LTD.

Inventor： Hiroto FUKUSHIMA ,  Akihiko HANYA ,  Kosaburo ITO ,  Tsukasa IMURA ,  Reiki TADA

IPC: G02F1/13357 ,  G02F1/1347 ,  H01L33/62 ,  G02F1/1343 ,  H01L23/00 ,  H01L25/075 ,  G02F1/1334

Abstract: The present invention provides a panel capable of switching between a state transparent to external light, a point light emitting state, and a surface light emitting state. Provided is a transparent panel provided with light emitting function, including: an LED die; a light transmitting substrate for LED, on which the LED die is mounted; a wiring pattern provided on a surface of the light transmitting substrate for LED and bonded to the LED die; and a light diffusing panel laminated on the light transmitting substrate for LED. The light diffusing panel includes: a pair of light transmitting substrates for liquid crystal; a liquid crystal layer sandwiched between the pair of light transmitting substrates for liquid crystal; and transparent conductive films disposed on the light transmitting substrates for liquid crystal, and is switchable between a transparent state and a light diffusion state.

公开(公告)号：US20180090035A1

公开(公告)日：2018-03-29

申请号：US15710565

申请日：2017-09-20

Applicant: STANLEY ELECTRIC CO., LTD.

Inventor： Akihiko HANYA ,  Kosaburo ITO ,  Yoshiyuki ABE

IPC: G09F7/00 ,  F21V33/00 ,  E04D13/10

CPC classification number: G09F7/002 ,  B60S1/026 ,  E04D13/103 ,  F21V33/00 ,  H05K1/0306 ,  H05K1/167 ,  H05K2201/0108 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/0162 ,  H05K2201/10106

Abstract: A thin light-transmitting substrate showing high thermal conduction efficiency, and having a function of raising surface temperature thereof is provided.The light-transmitting substrate of the present invention comprises a substrate that transmits at least a light of a predetermined wavelength, and a conductor pattern that is disposed on the substrate, and generates heat to raise temperature of the surface of the substrate when it is supplied with an electric current. The conductor pattern is directly disposed on the substrate without any adhesive layer.