公开(公告)号：US20200166802A1

公开(公告)日：2020-05-28

申请号：US16615242

申请日：2018-05-22

Applicant: STANLEY ELECTRIC CO., LTD.

Inventor： Hiroto FUKUSHIMA ,  Akihiko HANYA ,  Kosaburo ITO ,  Tsukasa IMURA ,  Reiki TADA

IPC: G02F1/13357 ,  G02F1/1347 ,  H01L33/62 ,  G02F1/1343 ,  H01L23/00 ,  H01L25/075 ,  G02F1/1334

Abstract: The present invention provides a panel capable of switching between a state transparent to external light, a point light emitting state, and a surface light emitting state. Provided is a transparent panel provided with light emitting function, including: an LED die; a light transmitting substrate for LED, on which the LED die is mounted; a wiring pattern provided on a surface of the light transmitting substrate for LED and bonded to the LED die; and a light diffusing panel laminated on the light transmitting substrate for LED. The light diffusing panel includes: a pair of light transmitting substrates for liquid crystal; a liquid crystal layer sandwiched between the pair of light transmitting substrates for liquid crystal; and transparent conductive films disposed on the light transmitting substrates for liquid crystal, and is switchable between a transparent state and a light diffusion state.

公开(公告)号：US20190223292A1

公开(公告)日：2019-07-18

申请号：US16247020

申请日：2019-01-14

Applicant: STANLEY ELECTRIC CO., LTD.

Inventor： Akihiko HANYA ,  Tsukasa IMURA

IPC: H05K1/18 ,  H05K3/12 ,  H05K3/30 ,  B22F7/06

CPC classification number: H05K1/181 ,  B22F7/064 ,  H05K3/1283 ,  H05K3/303 ,  H05K2203/1131

Abstract: Provided is an electronic device capable of supplying large current to a circuit pattern, without employing a thick film structure for the circuit pattern. The electronic device includes a substrate, a wiring layer placed on the upper surface of the substrate, an electronic component mounted above the wiring layer, and a bonding layer placed between the electronic component and the wiring layer. The wiring layer and the bonding layer are porous layers containing pores. The bonding layer has higher volume density than the wiring layer except underneath the electronic component.