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公开(公告)号：US20180077805A1
公开(公告)日：2018-03-15
申请号：US15560445
申请日：2016-03-17
Applicant: STANLEY ELECTRIC CO., LTD.
Inventor： Akihiko HANYA
CPC classification number: H05K3/1283 , B22F1/025 , H01B1/22 , H01L23/49822 , H01L24/17 , H01L24/32 , H01L24/83 , H05K1/097 , H05K1/145 , H05K1/186 , H05K3/102 , H05K2201/0108 , H05K2201/10106 , H05K2203/1131
Abstract: A method for producing an electronic device capable of connecting an electronic component precisely with a high-density circuit pattern includes applying a solution wherein conductive nanoparticles with a particle diameter of less than 1 μm and an insulating material are dispersed, or applying a solution wherein the conductive nanoparticles are coated with an insulating material layer, to a surface of an optically transparent substrate in a desired shape. A film of the conductive nanoparticles coated with the insulating material is formed. The electronic component is mounted on the film. The film is irradiated with light from a backside surface of the optically transparent substrate, and the light sinters the conductive nanoparticles. Accordingly, a first circuit pattern connected to electrodes of the electronic component is formed, and the first circuit pattern is adhered to the electrodes of the electronic component.
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公开(公告)号：US20220376155A1
公开(公告)日：2022-11-24
申请号：US17748519
申请日：2022-05-19
Applicant: STANLEY ELECTRIC CO., LTD.
Inventor： Takahiro IGARASHI , Shoko KASAI , Akihiko HANYA
Abstract: A laminated film in which a heat-resistant base film and a metal foil are bonded using an adhesive is provided with a barrier layer that prevents chemicals from entering the adhesive layer, between the metal foil and the adhesive layer. The barrier layer is made of a heat-resistant resin similar to that of the base film and has a water absorption rate of 1% or less. The adhesive layer is a silicone-based resin and has a thickness of 40 μm or more after drying.
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公开(公告)号：US20190355889A1
公开(公告)日：2019-11-21
申请号：US16400913
申请日：2019-05-01
Applicant: STANLEY ELECTRIC CO., LTD.
Inventor： Akihiko HANYA
IPC: H01L33/62 , H01L33/52 , H01L23/522 , H01L23/528
Abstract: An aspect of the invention provides a multilayer circuit substrate that has a simple configuration and is thin. The multilayer circuit substrate has a stacked multiple of substrates and a wiring pattern disposed so to be sandwiched between the stacked multiple of substrates. At least one portion of the wiring pattern is configured of a conductive material wherein conductive particles are sintered. An upper face of the wiring pattern is directly joined to the substrate positioned above the wiring pattern, a lower face of the wiring pattern is directly joined to the substrate positioned below the wiring pattern, and the stacked multiple of substrates are fixed to each other by the wiring pattern.
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公开(公告)号：US20180070440A1
公开(公告)日：2018-03-08
申请号：US15560439
申请日：2016-03-17
Applicant: STANLEY ELECTRIC CO., LTD.
Inventor： Akihiko HANYA
IPC: H05K1/02
CPC classification number: H05K1/0231 , H01L2224/16225 , H05K1/0265 , H05K1/095 , H05K1/097 , H05K3/125 , H05K3/1275 , H05K3/1283 , H05K3/3494 , H05K2201/0108 , H05K2201/0391 , H05K2201/09727 , H05K2201/09736 , H05K2203/1131 , H05K2203/1581
Abstract: An electronic device capable of supplying a large current to a circuit pattern containing conductive nanoparticles includes a substrate, a region provided on the substrate, configured to mount an electronic component therein, a first circuit pattern placed within the region and electrically connected to the electronic component, a second circuit pattern connected to the first circuit pattern and configured to supply current to the first circuit pattern from outside of the region. At least a part of the first circuit pattern includes a layer obtained by sintering conductive nanosized particles with a diameter of less than 1 μm. The second circuit pattern is thicker than the first circuit pattern.
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公开(公告)号：US20200166802A1
公开(公告)日：2020-05-28
申请号：US16615242
申请日：2018-05-22
Applicant: STANLEY ELECTRIC CO., LTD.
Inventor： Hiroto FUKUSHIMA , Akihiko HANYA , Kosaburo ITO , Tsukasa IMURA , Reiki TADA
IPC: G02F1/13357 , G02F1/1347 , H01L33/62 , G02F1/1343 , H01L23/00 , H01L25/075 , G02F1/1334
Abstract: The present invention provides a panel capable of switching between a state transparent to external light, a point light emitting state, and a surface light emitting state. Provided is a transparent panel provided with light emitting function, including: an LED die; a light transmitting substrate for LED, on which the LED die is mounted; a wiring pattern provided on a surface of the light transmitting substrate for LED and bonded to the LED die; and a light diffusing panel laminated on the light transmitting substrate for LED. The light diffusing panel includes: a pair of light transmitting substrates for liquid crystal; a liquid crystal layer sandwiched between the pair of light transmitting substrates for liquid crystal; and transparent conductive films disposed on the light transmitting substrates for liquid crystal, and is switchable between a transparent state and a light diffusion state.
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Patent Agency Ranking
6.发明申请公开(公告)号：US20180374834A1
公开(公告)日：2018-12-27
申请号：US16007470
申请日：2018-06-13
Applicant: STANLEY ELECTRIC CO., LTD.
Inventor： Reiki TADA , Akihiko HANYA
CPC classification number: H01L25/13 , H01L25/0753 , H01L25/0756 , H01L33/405 , H01L33/60 , H01L33/62
Abstract: Provided is an optically transparent plate having a structure where an LED die is directly mounted on an optically transparent substrate, and light extraction efficiency is improved. The optically transparent plate comprises, an optically transparent substrate, a wiring pattern placed on either of a surface on the upper side and a surface on the underside of the optically transparent substrate, or on both of the surfaces, and the LED die bonded to the wiring pattern. A reflective layer is placed on the other side, of the surface of the optically transparent substrate on which the LED die is mounted. At least a part of the wiring pattern and at least a part of the reflective layer comprise a conductive material obtained by sintering conductive particles.
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公开(公告)号：US20180158580A1
公开(公告)日：2018-06-07
申请号：US15568540
申请日：2016-03-23
Applicant: STANLEY ELECTRIC CO., LTD.
Inventor： Akihiko HANYA
IPC: H01C17/065 , H05K1/16 , H01C7/00 , H01C17/22
CPC classification number: H01C17/065 , H01B1/22 , H01C7/003 , H01C17/22 , H01C17/24 , H05K1/097 , H05K1/167 , H05K3/1283 , H05K2203/1131
Abstract: A resistor manufacturing method includes a first step of applying a solution wherein conductive nanosized particles with a particle diameter of less than 1 μm and an insulating material are at least dispersed, or a solution wherein the conductive nanosized particles covered with an insulating material layer are at least dispersed, in a desired form on a substrate surface, thereby forming a film. The resistor manufacturing method also includes a second step of irradiating one portion of the film with light in a predetermined pattern, and sintering the conductive nanosized particles with the light, thereby forming a resistive film that is a conductive particle layer of the predetermined pattern.
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公开(公告)号：US20240288138A1
公开(公告)日：2024-08-29
申请号：US18570538
申请日：2022-06-02
Applicant: Stanley Electric Co., Ltd.
Inventor： Reiki TADA , Akihiko HANYA
IPC: F21S41/20 , F21S41/143 , F21Y115/10
CPC classification number: F21S41/285 , F21S41/143 , F21Y2115/10
Abstract: Provided is an on-vehicle illumination device which is compact, does not have a space therein, and is capable of realizing a complex curved surface shape. The on-vehicle illumination device includes a light-emitting element disposed on a wiring pattern on a substrate, and an outer lens layer made of a resin and mounted on the light-emitting element. The substrate has a shape curved along a curvature of the outer lens layer in a front-rear direction.
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9.发明申请公开(公告)号：US20190291640A1
公开(公告)日：2019-09-26
申请号：US16360089
申请日：2019-03-21
Applicant: STANLEY ELECTRIC CO., LTD.
Inventor： Akihiko HANYA , Toshihiko MINODA
IPC: B60Q9/00 , H05B33/08 , H01L25/075 , H01L33/62 , B60Q1/04
Abstract: Provided is a sheet for drawing user's eyes and guiding the line of sight. A visual line guidance sheet is arranged to cover at least a part of a window for a user to look out therethrough, and configured to guide the user's line of sight, by illuminating a partial region on the visual line guidance sheet. The visual line guidance sheet includes an optically transparent substrate layer, a plurality of LED dies, and a wiring pattern. The controller receives from an imager, an image obtained by imaging a region visible by the user through the window, detects an object targeted for visual line guidance, included in the image, and illuminates the LED dies on the visual line guidance sheet, corresponding to a position of the object.
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公开(公告)号：US20190223292A1
公开(公告)日：2019-07-18
申请号：US16247020
申请日：2019-01-14
Applicant: STANLEY ELECTRIC CO., LTD.
Inventor： Akihiko HANYA , Tsukasa IMURA
CPC classification number: H05K1/181 , B22F7/064 , H05K3/1283 , H05K3/303 , H05K2203/1131
Abstract: Provided is an electronic device capable of supplying large current to a circuit pattern, without employing a thick film structure for the circuit pattern. The electronic device includes a substrate, a wiring layer placed on the upper surface of the substrate, an electronic component mounted above the wiring layer, and a bonding layer placed between the electronic component and the wiring layer. The wiring layer and the bonding layer are porous layers containing pores. The bonding layer has higher volume density than the wiring layer except underneath the electronic component.
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