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公开(公告)号：US20180130930A1
公开(公告)日：2018-05-10
申请号：US15800495
申请日：2017-11-01
发明人： Kaori TACHIBANA , Yuichi ITO
CPC分类号： H01L33/505 , H01L33/56 , H01L33/60 , H01L2933/0091
摘要： To improve light emission efficiency and suppress color unevenness on a light emitting surface. Provided is a semiconductor light emitting device including a light emitting element, a wavelength conversion layer for converting light emitted from the light emitting element to light having a predetermined wavelength, a light reflection member covering at least the side surfaces of the wavelength conversion layer, and a thin film provided on the outermost surface from which the light wavelength-converted by the wavelength conversion layer exits, having a property for shedding the uncured light reflection member, and having a coarse surface.
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2.发明申请公开(公告)号：US20220416132A1
公开(公告)日：2022-12-29
申请号：US17845909
申请日：2022-06-21
发明人： Yuichi ITO
摘要： A semiconductor light-emitting device includes: a substrate having a wiring electrode; a semiconductor light-emitting element mounted on the wiring electrode and having a light-emitting functional layer with an upper surface exposed; a wavelength conversion plate mounted on the light-emitting functional layer and being made of a sintered body including fluorescent material particles and binder particles; and an adhesive layer including a resin medium for adhering a light-incident surface of the wavelength conversion plate to a light output surface of the light-emitting functional layer, and resin particles dispersed in the resin medium. The light-incident surface can expose a sintered surface of the sintered body with a concave portion, and the resin particles are fitted in the concave portion and compressively deformed. The semiconductor light-emitting device is capable of reducing the heat generated from the wavelength conversion plate and of maintaining the high light output.
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