公开(公告)号：US10134664B2

公开(公告)日：2018-11-20

申请号：US15433866

申请日：2017-02-15

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： MinKyung Kang ,  YoungDal Roh ,  Dong Ju Jeon ,  KyoungHee Park

IPC: H01L23/49 ,  H01L21/50 ,  H01L23/498 ,  H01L21/48 ,  H01L23/00

Abstract: An integrated circuit packaging system and method of manufacture thereof includes: a dielectric core having an embedded pad; a top solder resist layer on the dielectric core, a pad top surface of the embedded pad below the top solder resist layer; a device interconnect attached to the embedded pad; and an integrated circuit device having an interconnect pillar, the interconnect pillar attached to the device interconnect for mounting the integrated circuit device to the dielectric core.

公开(公告)号：US20170162495A1

公开(公告)日：2017-06-08

申请号：US15433866

申请日：2017-02-15

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： MinKyung Kang ,  YoungDal Roh ,  Dong Ju Jeon ,  KyoungHee Park

IPC: H01L23/498 ,  H01L23/00 ,  H01L21/48

CPC classification number: H01L23/49838 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/49811 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49894 ,  H01L24/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2924/3841

Abstract: An integrated circuit packaging system and method of manufacture thereof includes: a dielectric core having an embedded pad; a top solder resist layer on the dielectric core, a pad top surface of the embedded pad below the top solder resist layer; a device interconnect attached to the embedded pad; and an integrated circuit device having an interconnect pillar, the interconnect pillar attached to the device interconnect for mounting the integrated circuit device to the dielectric core.