公开(公告)号：US20240234229A1

公开(公告)日：2024-07-11

申请号：US18395641

申请日：2023-12-25

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： JiEun KWON ,  KyoWang KOO ,  HyunYoung KIM ,  SooBin YOO

IPC: H01L23/31 ,  H01L23/498

CPC classification number: H01L23/3121 ,  H01L23/315 ,  H01L23/49811

Abstract: A method for making a semiconductor device using a double side molding technology is provided. The method includes: providing a substrate having a first surface and a second surface opposite to the first surface, wherein the second surface of the substrate is uneven; forming a coating on the second surface of the substrate such that a first surface of the coating, which is facing away from the second surface of the substrate, is even; mounting a first electronic component on the first surface of the substrate; and forming a first encapsulant on the first surface of the substrate to cover the first electronic component.

公开(公告)号：US20230230856A1

公开(公告)日：2023-07-20

申请号：US18154024

申请日：2023-01-12

Applicant: STATS ChipPAC Pte. Ltd

Inventor： YoungSang KIM ,  JiEun KWON ,  JiSik MOON

IPC: H01L21/56 ,  H01L23/31 ,  H01L23/498 ,  H01L23/552 ,  H01L21/48

CPC classification number: H01L21/565 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49838 ,  H01L23/552 ,  H01L21/4853

Abstract: A method for making a semiconductor device is provided. The method includes: providing a package including: a substrate including a first surface and a second surface opposite to the first surface; a first electronic component mounted on the first surface of the substrate; a second electronic component mounted on the second surface; and a contact pad formed on the second surface of the substrate, wherein the contact pad is outside of a projection of the second electronic component on the second surface of the substrate; and a first encapsulant disposed on the first surface of the substrate and covering the first electronic component; forming a second encapsulant over and around the second electronic component, wherein the contact pad is exposed from the second encapsulant; planarizing the second encapsulant to expose the second electronic component; and forming a bump on the contact pad of the second surface of the substrate.