公开(公告)号：US10651139B2

公开(公告)日：2020-05-12

申请号：US15177081

申请日：2016-06-08

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： Guruprasad G. Badakere ,  Zigmund R. Camacho ,  Lionel Chien Hui Tay

IPC: H01L23/528 ,  H01L23/00 ,  H01L23/31 ,  H01L23/58 ,  H01L21/56 ,  H01L21/683

Abstract: A semiconductor die has active circuits formed on its active surface. Contact pads are formed on the active surface of the semiconductor die and coupled to the active circuits. A die extension region is formed around a periphery of the semiconductor die. Conductive THVs are formed in the die extension region. A wafer level conductive plane or ring is formed on a center area of the active surface. The conductive plane or ring is connected to a first contact pad to provide a first power supply potential to the active circuits, and is electrically connected to a first conductive THV. A conductive ring is formed partially around a perimeter of the conductive plane or ring and connected to a second contact pad for providing a second power supply potential to the active circuits. The conductive ring is electrically connected to a second THV.

公开(公告)号：US20160293558A1

公开(公告)日：2016-10-06

申请号：US15177081

申请日：2016-06-08

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： Guruprasad G. Badakere ,  Zigmund R. Camacho ,  Lionel Chien Hui Tay

IPC: H01L23/00 ,  H01L23/31 ,  H01L21/56

CPC classification number: H01L24/02 ,  H01L21/565 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3114 ,  H01L23/3157 ,  H01L23/3171 ,  H01L23/3185 ,  H01L23/528 ,  H01L23/5286 ,  H01L23/585 ,  H01L24/05 ,  H01L24/13 ,  H01L24/18 ,  H01L24/19 ,  H01L24/82 ,  H01L24/96 ,  H01L2224/02315 ,  H01L2224/02371 ,  H01L2224/02379 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/05024 ,  H01L2224/12105 ,  H01L2224/13026 ,  H01L2224/18 ,  H01L2224/32145 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01061 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/30105 ,  H01L2924/00

Abstract: A semiconductor die has active circuits formed on its active surface. Contact pads are formed on the active surface of the semiconductor die and coupled to the active circuits. A die extension region is formed around a periphery of the semiconductor die. Conductive THVs are formed in the die extension region. A wafer level conductive plane or ring is formed on a center area of the active surface. The conductive plane or ring is connected to a first contact pad to provide a first power supply potential to the active circuits, and is electrically connected to a first conductive THV. A conductive ring is formed partially around a perimeter of the conductive plane or ring and connected to a second contact pad for providing a second power supply potential to the active circuits. The conductive ring is electrically connected to a second THV.

Abstract translation: 半导体管芯具有在其有源表面上形成的有源电路。 接触焊盘形成在半导体管芯的有源表面上并耦合到有源电路。 在半导体管芯的周围形成管芯延伸区域。 导电THV形成在芯片延伸区域中。 晶片级导电平面或环形成在有源表面的中心区域上。 导电平面或环连接到第一接触焊盘以向有源电路提供第一电源电位，并且电连接到第一导电THV。 导电环部分地围绕导电平面或环的周边形成并且连接到第二接触焊盘，以向有源电路提供第二电源电位。 导电环电连接到第二THV。