公开(公告)号：US11434561B2

公开(公告)日：2022-09-06

申请号：US17032437

申请日：2020-09-25

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： OhHan Kim ,  HunTeak Lee ,  Sell Jung ,  HeeSoo Lee

IPC: C23C14/50 ,  H01L23/00 ,  H01L23/498 ,  H01L23/552 ,  C23C14/34

Abstract: A semiconductor manufacturing device has a cooling pad with a plurality of movable pins. The cooling pad includes a fluid pathway and a plurality of springs disposed in the fluid pathway. Each of the plurality of springs is disposed under a respective movable pin. A substrate includes an electrical component disposed over a surface of the substrate. The substrate is disposed over the cooling pad with the electrical component oriented toward the cooling pad. A force is applied to the substrate to compress the springs. At least one of the movable pins contacts the substrate. A cooling fluid is disposed through the fluid pathway.

公开(公告)号：US20240183026A1

公开(公告)日：2024-06-06

申请号：US18440068

申请日：2024-02-13

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： OhHan Kim ,  HunTeak Lee ,  Sell Jung ,  HeeSoo Lee

IPC: C23C14/50 ,  C23C14/34 ,  H01L23/00 ,  H01L23/498 ,  H01L23/552

CPC classification number: C23C14/50 ,  C23C14/34 ,  H01L23/49838 ,  H01L23/552 ,  H01L24/16 ,  H01L2224/16227 ,  H01L2924/19105 ,  H01L2924/19106 ,  H01L2924/3025

Abstract: A semiconductor manufacturing device has a cooling pad with a plurality of movable pins. The cooling pad includes a fluid pathway and a plurality of springs disposed in the fluid pathway. Each of the plurality of springs is disposed under a respective movable pin. A substrate includes an electrical component disposed over a surface of the substrate. The substrate is disposed over the cooling pad with the electrical component oriented toward the cooling pad. A force is applied to the substrate to compress the springs. At least one of the movable pins contacts the substrate. A cooling fluid is disposed through the fluid pathway.

公开(公告)号：US11932933B2

公开(公告)日：2024-03-19

申请号：US17814796

申请日：2022-07-25

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： OhHan Kim ,  HunTeak Lee ,  Sell Jung ,  HeeSoo Lee

IPC: C23C14/50 ,  C23C14/34 ,  H01L23/00 ,  H01L23/498 ,  H01L23/552

CPC classification number: C23C14/50 ,  C23C14/34 ,  H01L23/49838 ,  H01L23/552 ,  H01L24/16 ,  H01L2224/16227 ,  H01L2924/19105 ,  H01L2924/19106 ,  H01L2924/3025

Abstract: A semiconductor manufacturing device has a cooling pad with a plurality of movable pins. The cooling pad includes a fluid pathway and a plurality of springs disposed in the fluid pathway. Each of the plurality of springs is disposed under a respective movable pin. A substrate includes an electrical component disposed over a surface of the substrate. The substrate is disposed over the cooling pad with the electrical component oriented toward the cooling pad. A force is applied to the substrate to compress the springs. At least one of the movable pins contacts the substrate. A cooling fluid is disposed through the fluid pathway.