公开(公告)号：US11735489B2

公开(公告)日：2023-08-22

申请号：US17349135

申请日：2021-06-16

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： TaeKeun Lee ,  Youngcheol Kim ,  Youngmin Kim ,  Yongmin Kim

IPC: H01L23/48 ,  H01L23/367 ,  H01L23/498 ,  H01L21/48 ,  H01L23/00 ,  H01L23/373 ,  H01L21/78

CPC classification number: H01L23/367 ,  H01L21/4857 ,  H01L21/4882 ,  H01L23/3735 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49833 ,  H01L23/49838 ,  H01L24/16 ,  H01L21/78 ,  H01L2224/16235 ,  H01L2924/35121

Abstract: A semiconductor device has an electrical component and a first TIM with a first compliant property is disposed over a surface of the electrical component. A second TIM having a second compliant property greater than the first compliant property is disposed over the surface of the electrical component within the first TIM. A third TIM can be disposed over the surface of the electrical component along the first TIM. A heat sink is disposed over the first TIM and second TIM. The second TIM has a shape of a star pattern, grid of dots, parallel lines, serpentine, or concentric geometric shapes. The first TIM provides adhesion for joint reliability and the second TIM provides stress relief. Alternatively, a heat spreader is disposed over the first TIM and second TIM and a heat sink is disposed over a third TIM and fourth TIM on the heat spreader.

公开(公告)号：US11830785B2

公开(公告)日：2023-11-28

申请号：US17450146

申请日：2021-10-06

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： TaeKeun Lee ,  Youngmin Kim ,  Yongmin Kim

IPC: H01L23/367 ,  H01L25/065 ,  H01L25/10 ,  H01L25/00

CPC classification number: H01L23/3675 ,  H01L25/0655 ,  H01L25/105 ,  H01L25/50

Abstract: A semiconductor device has a substrate and a first semiconductor die disposed over the substrate. A subpackage is also disposed over the substrate. A stiffener is disposed over the substrate around the first semiconductor die and subpackage. A heat spreader is disposed over the stiffener. The heat spreader is thermally coupled to the first semiconductor die. The heat spreader has an opening over the subpackage.

公开(公告)号：US20220406675A1

公开(公告)日：2022-12-22

申请号：US17349135

申请日：2021-06-16

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： TaeKeun Lee ,  Youngcheol Kim ,  Youngmin Kim ,  Yongmin Kim

IPC: H01L23/367 ,  H01L23/498 ,  H01L23/373 ,  H01L21/48 ,  H01L23/00

Abstract: A semiconductor device has an electrical component and a first TIM with a first compliant property is disposed over a surface of the electrical component. A second TIM having a second compliant property greater than the first compliant property is disposed over the surface of the electrical component within the first TIM. A third TIM can be disposed over the surface of the electrical component along the first TIM. A heat sink is disposed over the first TIM and second TIM. The second TIM has a shape of a star pattern, grid of dots, parallel lines, serpentine, or concentric geometric shapes. The first TIM provides adhesion for joint reliability and the second TIM provides stress relief. Alternatively, a heat spreader is disposed over the first TIM and second TIM and a heat sink is disposed over a third TIM and fourth TIM on the heat spreader.

公开(公告)号：US12125764B2

公开(公告)日：2024-10-22

申请号：US18344182

申请日：2023-06-29

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： TaeKeun Lee ,  Youngcheol Kim ,  Youngmin Kim ,  Yongmin Kim

IPC: H01L23/48 ,  H01L21/48 ,  H01L23/00 ,  H01L23/367 ,  H01L23/373 ,  H01L23/498 ,  H01L21/78

CPC classification number: H01L23/367 ,  H01L21/4857 ,  H01L21/4882 ,  H01L23/3735 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49833 ,  H01L23/49838 ,  H01L24/16 ,  H01L21/78 ,  H01L2224/16235 ,  H01L2924/35121

Abstract: A semiconductor device has an electrical component and a first TIM with a first compliant property is disposed over a surface of the electrical component. A second TIM having a second compliant property greater than the first compliant property is disposed over the surface of the electrical component within the first TIM. A third TIM can be disposed over the surface of the electrical component along the first TIM. A heat sink is disposed over the first TIM and second TIM. The second TIM has a shape of a star pattern, grid of dots, parallel lines, serpentine, or concentric geometric shapes. The first TIM provides adhesion for joint reliability and the second TIM provides stress relief. Alternatively, a heat spreader is disposed over the first TIM and second TIM and a heat sink is disposed over a third TIM and fourth TIM on the heat spreader.

公开(公告)号：US20230352359A1

公开(公告)日：2023-11-02

申请号：US18344182

申请日：2023-06-29

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： TaeKeun Lee ,  Youngcheol Kim ,  Youngmin Kim ,  Yongmin Kim

IPC: H01L21/48 ,  H01L23/373 ,  H01L23/498 ,  H01L23/00 ,  H01L23/367

CPC classification number: H01L23/367 ,  H01L21/4857 ,  H01L21/4882 ,  H01L23/3735 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49833 ,  H01L23/49838 ,  H01L24/16 ,  H01L21/78 ,  H01L2224/16235 ,  H01L2924/35121

Abstract: A semiconductor device has an electrical component and a first TIM with a first compliant property is disposed over a surface of the electrical component. A second TIM having a second compliant property greater than the first compliant property is disposed over the surface of the electrical component within the first TIM. A third TIM can be disposed over the surface of the electrical component along the first TIM. A heat sink is disposed over the first TIM and second TIM. The second TIM has a shape of a star pattern, grid of dots, parallel lines, serpentine, or concentric geometric shapes. The first TIM provides adhesion for joint reliability and the second TIM provides stress relief. Alternatively, a heat spreader is disposed over the first TIM and second TIM and a heat sink is disposed over a third TIM and fourth TIM on the heat spreader.

公开(公告)号：US20230118190A1

公开(公告)日：2023-04-20

申请号：US17450146

申请日：2021-10-06

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： TaeKeun Lee ,  Youngmin Kim ,  Yongmin Kim

IPC: H01L23/367 ,  H01L25/00 ,  H01L25/10 ,  H01L25/065

Abstract: A semiconductor device has a substrate and a first semiconductor die disposed over the substrate. A subpackage is also disposed over the substrate. A stiffener is disposed over the substrate around the first semiconductor die and subpackage. A heat spreader is disposed over the stiffener. The heat spreader is thermally coupled to the first semiconductor die. The heat spreader has an opening over the subpackage.