Gas diffusion method for fabricating semiconductor devices
    1.
    发明授权
    Gas diffusion method for fabricating semiconductor devices 失效
    用于制造半导体器件的气体扩散方法

    公开(公告)号:US3553037A

    公开(公告)日:1971-01-05

    申请号:US3553037D

    申请日:1968-04-05

    Inventor: BELL HARVEY W

    CPC classification number: C30B31/14 C30B31/16 Y10S118/90

    Abstract: A SUPPORTING DEVICE FOR SEMICONDUCTOR WAFERS TO BE USED DURING DEPOSITION AND DIFFUSION PROCESS STEPS BY WHICH THE WAFERS AE ORIENTED AT AN UPWARD SLOPING ANGLE IN THE DIRECTION OF GAS FLOW. THE WAFERS ARE LOADED ON THE DEVICES SO THAT THE SURFACES AT WHICH THE SEMICONDUCTOR DEVICES ARE BEING FABRICATED ARE FACING DOWNWARD AND TOWARDS THE DOWNSTREAM END TO THEREBY PROVIDE AN

    EVEN GAS FLOW ACROSS THE FACE OF EACH WAFER AND PREVENT THE DEPOSIT ON THE DESIRED SURFACES OF ANY CONTAMINANTS WHICH MIGHT BE KNOCKED LOOSE FROM THE INTERIOR SURFACE OF THE REACTION TUBE.

    Improved device for supporting semiconductor wafers
    2.
    发明授权
    Improved device for supporting semiconductor wafers 失效
    改进的支持半导体波形的器件

    公开(公告)号:US3678893A

    公开(公告)日:1972-07-25

    申请号:US3678893D

    申请日:1970-05-01

    Inventor: BELL HARVEY W

    Abstract: A supporting device for semiconductor wafers to be used during deposition and diffusion process steps by which the wafers are oriented at an upward sloping angle in the direction of gas flow. The wafers are loaded on the devices so that the surfaces at which the semiconductor devices are being fabricated are facing downward and towards the downstream end to thereby provide an even gas flow across the face of each wafer and prevent the deposit on the desired surfaces of any contaminants which might be knocked loose from the interior surface of the reaction tube.

    Abstract translation: 用于在沉积和扩散工艺步骤期间使用的半导体晶片的支撑装置,通过该支撑装置,晶片沿气流方向以向上倾斜的角度定向。 晶片被装载在器件上,使得制造半导体器件的表面面向下并朝向下游端,从而在每个晶片的表面上提供均匀的气流,并防止沉积在任何 污染物可能从反应管的内表面被破坏。

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