公开(公告)号：US20220285249A1

公开(公告)日：2022-09-08

申请号：US17752567

申请日：2022-05-24

Applicant: STMICROELECTRONICS, INC.

Inventor： Aaron CADAG ,  Frederick ARELLANO ,  Ernesto ANTILANO, JR.

IPC: H01L23/495 ,  H01L23/00 ,  H01L21/56 ,  H01L23/31 ,  B81B7/00 ,  B81C1/00

Abstract: A MEMS pressure sensor packaged with a molding compound. The MEMS pressure sensor features a lead frame, a MEMS semiconductor die, a second semiconductor die, multiple pluralities of bonding wires, and a molding compound. The MEMS semiconductor die has an internal chamber, a sensing component, and apertures. The MEMS semiconductor die and the apertures are exposed to an ambient atmosphere. A method is desired to form a MEMS pressure sensor package that reduces defects caused by mold flashing and die cracking. Fabrication of the MEMS pressure sensor package comprises placing a lead frame on a lead frame tape; placing a MEMS semiconductor die adjacent to the lead frame and on the lead frame tape with the apertures facing the tape and being sealed thereby; attaching a second semiconductor die to the MEMS semiconductor die; attaching pluralities of bonding wires to form electrical connections between the MEMS semiconductor die, the second semiconductor die, and the lead frame; and forming a molding compound.

公开(公告)号：US20200020616A1

公开(公告)日：2020-01-16

申请号：US16584405

申请日：2019-09-26

Applicant: STMICROELECTRONICS, INC.

Inventor： Aaron CADAG ,  Frederick ARELLANO ,  Ernesto ANTILANO, JR.

IPC: H01L23/495 ,  H01L23/31 ,  H01L23/00 ,  H01L21/56

Abstract: A MEMS pressure sensor packaged with a molding compound. The MEMS pressure sensor features a lead frame, a MEMS semiconductor die, a second semiconductor die, multiple pluralities of bonding wires, and a molding compound. The MEMS semiconductor die has an internal chamber, a sensing component, and apertures. The MEMS semiconductor die and the apertures are exposed to an ambient atmosphere. A method is desired to form a MEMS pressure sensor package that reduces defects caused by mold flashing and die cracking. Fabrication of the MEMS pressure sensor package comprises placing a lead frame on a lead frame tape; placing a MEMS semiconductor die adjacent to the lead frame and on the lead frame tape with the apertures facing the tape and being sealed thereby; attaching a second semiconductor die to the MEMS semiconductor die; attaching pluralities of bonding wires to form electrical connections between the MEMS semiconductor die, the second semiconductor die, and the lead frame; and forming a molding compound.

公开(公告)号：US20190148271A1

公开(公告)日：2019-05-16

申请号：US16249612

申请日：2019-01-16

Applicant: STMicroelectronics, Inc.

Inventor： Rennier RODRIGUEZ ,  Raymond Albert NARVADEZ ,  Ernesto ANTILANO, JR.

IPC: H01L23/495 ,  H01L21/48 ,  H01L23/31 ,  H01L21/56

Abstract: The present disclosure is directed to a leadframe package having leads with protrusions on an underside of the leadframe. The protrusions come in various shapes and sizes. The protrusions extend from a body of encapsulant around the leadframe to couple to surface contacts on a substrate. The protrusions have a recess that is filled with encapsulant. Additionally, the protrusions may be part of the lead or may be a conductive layer on the lead. In some embodiments a die pad of the leadframe supporting a semiconductor die also has a protrusion on the underside of the leadframe. The protrusion on the die pad has a recess that houses an adhesive and at least part of the semiconductor die. The die pad with a protrusion may include anchor locks at the ends of the die pad to couple to the encapsulant.

公开(公告)号：US20180358286A1

公开(公告)日：2018-12-13

申请号：US16107807

申请日：2018-08-21

Applicant: STMicroelectronics, Inc.

Inventor： Aaron CADAG ,  Ernesto ANTILANO, JR. ,  Ela Mia CADAG

IPC: H01L23/495 ,  H01L21/48 ,  H01L21/78 ,  H01L21/56 ,  H01L23/31

CPC classification number: H01L23/49541 ,  H01L21/4853 ,  H01L21/561 ,  H01L21/565 ,  H01L21/78 ,  H01L23/3121 ,  H01L23/3192 ,  H01L23/49503 ,  H01L23/4952 ,  H01L23/49548 ,  H01L23/49582 ,  H01L23/49861 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: The present disclosure is directed to a leadframe package having solder wettable sidewalls that is formed using a pre-molded leadframe and methods of manufacturing the same. A metal plated leadframe with a plurality of recesses and a plurality of apertures is placed into a top and bottom mold tool. A molding compound is then formed in the plurality of recesses and apertures in the leadframe to form a pre-molded leadframe. A plurality of die and wires are coupled to the pre-molded leadframe and the resulting combination is covered in an encapsulant. Alternatively, a bare leadframe can be processed and the metal layer can be applied after encapsulation. A saw or other cutting means is used for singulation to form leadframe packages. Each resulting leadframe package has a solder wettable sidewall for improving the strength of solder joints between the package and a circuit board.