公开(公告)号：US20170186698A1

公开(公告)日：2017-06-29

申请号：US14982018

申请日：2015-12-29

Applicant: STMICROELECTRONICS, INC.

Inventor： Godfrey DIMAYUGA ,  Frederick ARELLANO ,  Michael TABIERA

IPC: H01L23/552 ,  H01L23/00 ,  H01L21/56 ,  H01L23/31

CPC classification number: H01L23/552 ,  H01L21/561 ,  H01L21/563 ,  H01L23/3114 ,  H01L23/3128 ,  H01L24/43 ,  H01L24/48 ,  H01L24/49 ,  H01L24/85 ,  H01L24/97 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/48249 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/00 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2224/45099 ,  H01L2224/32245 ,  H01L2224/48247

Abstract: An electronic package includes a substrate having opposing first and second surfaces. Conductive areas are on a first surface of the substrate and include at least one edge conductive area. A plurality of conductive bumps are on the second surface of the substrate and coupled to respective ones of the conductive areas. An integrated circuit (IC) is carried by the substrate. Bond wires are coupled between the IC and respective ones of the conductive areas. An encapsulating material is over the IC and adjacent portions of the substrate. A conductive layer is on the encapsulating material, and at least one conductive body is coupled between the at least one edge conductive area and the conductive layer.

公开(公告)号：US20220285249A1

公开(公告)日：2022-09-08

申请号：US17752567

申请日：2022-05-24

Applicant: STMICROELECTRONICS, INC.

Inventor： Aaron CADAG ,  Frederick ARELLANO ,  Ernesto ANTILANO, JR.

IPC: H01L23/495 ,  H01L23/00 ,  H01L21/56 ,  H01L23/31 ,  B81B7/00 ,  B81C1/00

Abstract: A MEMS pressure sensor packaged with a molding compound. The MEMS pressure sensor features a lead frame, a MEMS semiconductor die, a second semiconductor die, multiple pluralities of bonding wires, and a molding compound. The MEMS semiconductor die has an internal chamber, a sensing component, and apertures. The MEMS semiconductor die and the apertures are exposed to an ambient atmosphere. A method is desired to form a MEMS pressure sensor package that reduces defects caused by mold flashing and die cracking. Fabrication of the MEMS pressure sensor package comprises placing a lead frame on a lead frame tape; placing a MEMS semiconductor die adjacent to the lead frame and on the lead frame tape with the apertures facing the tape and being sealed thereby; attaching a second semiconductor die to the MEMS semiconductor die; attaching pluralities of bonding wires to form electrical connections between the MEMS semiconductor die, the second semiconductor die, and the lead frame; and forming a molding compound.

公开(公告)号：US20200020616A1

公开(公告)日：2020-01-16

申请号：US16584405

申请日：2019-09-26

Applicant: STMICROELECTRONICS, INC.

Inventor： Aaron CADAG ,  Frederick ARELLANO ,  Ernesto ANTILANO, JR.

IPC: H01L23/495 ,  H01L23/31 ,  H01L23/00 ,  H01L21/56

Abstract: A MEMS pressure sensor packaged with a molding compound. The MEMS pressure sensor features a lead frame, a MEMS semiconductor die, a second semiconductor die, multiple pluralities of bonding wires, and a molding compound. The MEMS semiconductor die has an internal chamber, a sensing component, and apertures. The MEMS semiconductor die and the apertures are exposed to an ambient atmosphere. A method is desired to form a MEMS pressure sensor package that reduces defects caused by mold flashing and die cracking. Fabrication of the MEMS pressure sensor package comprises placing a lead frame on a lead frame tape; placing a MEMS semiconductor die adjacent to the lead frame and on the lead frame tape with the apertures facing the tape and being sealed thereby; attaching a second semiconductor die to the MEMS semiconductor die; attaching pluralities of bonding wires to form electrical connections between the MEMS semiconductor die, the second semiconductor die, and the lead frame; and forming a molding compound.

公开(公告)号：US20170263566A1

公开(公告)日：2017-09-14

申请号：US15068752

申请日：2016-03-14

Applicant: STMICROELECTRONICS, INC

Inventor： Rennier RODRIGUEZ ,  Frederick ARELLANO ,  Aiza Marie AGUDON

IPC: H01L23/552 ,  H01L23/31 ,  H01L21/78 ,  H01L23/29 ,  H01L21/48 ,  H01L21/56

CPC classification number: H01L23/552 ,  H01L21/4814 ,  H01L21/561 ,  H01L21/78 ,  H01L23/29 ,  H01L23/3121 ,  H01L23/3135 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/16227 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2224/81

Abstract: A method for making shielded integrated circuit (IC) packages includes providing spaced apart IC dies carried by a substrate and covered by a common encapsulating material, and cutting through the common encapsulating material between adjacent IC dies to define spaced apart IC packages carried by the substrate. An electrically conductive layer is positioned over the spaced apart IC packages and fills spaces between adjacent IC packages. The method further includes cutting through the electrically conductive layer between adjacent IC packages and through the substrate to form the shielded IC packages.