公开(公告)号：US20200343168A1

公开(公告)日：2020-10-29

申请号：US16848635

申请日：2020-04-14

Applicant: STMICROELECTRONICS, INC.

Inventor： Ela Mia CADAG ,  Frederick Ray GOMEZ ,  Aaron CADAG

IPC: H01L23/498 ,  H01L23/00 ,  H01L21/48

Abstract: Generally described, one or more embodiments are directed to semiconductor packages comprising a plurality of leads and methods of forming same. The plurality of leads include active leads that are electrically coupled to bond pads of a semiconductor die and thereby coupled to active components of the semiconductor die, and inactive leads that are not electrically coupled to bond pads of the semiconductor die. The active leads have surfaces that are exposed at a lower surface of the semiconductor package and forms lands, while the inactive leads are not exposed at the lower surface of the package.

公开(公告)号：US20190326201A1

公开(公告)日：2019-10-24

申请号：US16460704

申请日：2019-07-02

Applicant: STMICROELECTRONICS, INC.

Inventor： Frederick Ray GOMEZ ,  Tito Mangaoang, JR. ,  Jefferson Talledo

IPC: H01L23/495 ,  H01L21/56 ,  H01L23/60 ,  H01L21/48

Abstract: According to principles of the disclosure as explained herein, selected leads are electrically connected through metal strips to the lead frame until the end of the manufacturing process. The lead frame is grounded through the manufacturing process to prevent any ESD event from causing damage to the protected leads. In the final singulation step, the leads are electrically isolated from each other and from the lead frame, thus maintaining protection from a potential ESD event up until the final package singulation step.

公开(公告)号：US20190006266A1

公开(公告)日：2019-01-03

申请号：US15636533

申请日：2017-06-28

Applicant: STMICROELECTRONICS, INC.

Inventor： Frederick Ray GOMEZ ,  Tito MANGAOANG, JR. ,  Jefferson TALLEDO

IPC: H01L23/495 ,  H01L23/31 ,  H01L23/00 ,  H01L21/66 ,  H01L21/56

CPC classification number: H01L23/4952 ,  H01L21/4832 ,  H01L21/56 ,  H01L21/561 ,  H01L22/12 ,  H01L23/3107 ,  H01L23/49548 ,  H01L23/60 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L24/92 ,  H01L2223/544 ,  H01L2224/04042 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49052 ,  H01L2224/73265 ,  H01L2224/83855 ,  H01L2224/85013 ,  H01L2224/85424 ,  H01L2224/85447 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

Abstract: According to principles of the disclosure as explained herein, selected leads are electrically connected through metal strips to the lead frame until the end of the manufacturing process. The lead frame is grounded through the manufacturing process to prevent any ESD event from causing damage to the protected leads. In the final singulation step, the leads are electrically isolated from each other and from the lead frame, thus maintaining protection from a potential ESD event up until the final package singulation step.