公开(公告)号：US20160104805A1

公开(公告)日：2016-04-14

申请号：US14512619

申请日：2014-10-13

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Loic Pierre Louis Renard ,  Kok-Leong Cheng

IPC: H01L31/02 ,  H01L27/14 ,  H01L31/18

CPC classification number: H01L31/02002 ,  H01L24/05 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/85 ,  H01L27/14636 ,  H01L31/186 ,  H01L2224/05014 ,  H01L2224/05554 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/1204 ,  H01L2924/14 ,  H01L2924/00015 ,  H01L2224/05599

Abstract: A method for making an optical semiconductor device may include forming an integrated circuit (IC) including an optical sensing area and a bond pads outside the optical sensing area, and coupling proximal ends of respective bond wires to corresponding bond pads. The method may further include performing a blackening treatment on the bond wires.

Abstract translation: 制造光学半导体器件的方法可以包括形成包括光学感测区域和光学感测区域外的接合焊盘的集成电路（IC），以及将各个接合线的近端耦合到相应的接合焊盘。 该方法还可以包括对接合线进行黑化处理。