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公开(公告)号:US10254338B2
公开(公告)日:2019-04-09
申请号:US15221211
申请日:2016-07-27
发明人: Nicolas Bernard Grossier , Lorenzo Guerrieri , Giuseppe Livio Gobbato , Daniele Zerbini , Martina Cordoni , Pasqualina Fragneto
IPC分类号: G01R31/3177 , G01R31/317 , H04B3/54 , H02J13/00 , H05B37/02 , G06F11/30 , G01R31/28 , G06F11/36 , G06F11/24 , G06F1/26
摘要: A semiconductor device, for example an integrated circuit such as a microcontroller (MCU) or a digital signal processor (DSP), includes a semiconductor die coupled with a power supply line, a debug module coupled with the semiconductor die to exchange semiconductor die debug command and data signals with the semiconductor die, and a modem coupled with the power supply line. The debug module is arranged to convey the semiconductor die debug command and data signals over the power supply line.