公开(公告)号：US20210204049A1

公开(公告)日：2021-07-01

申请号：US17204613

申请日：2021-03-17

Applicant: STMICROELECTRONICS S.R.L. ,  STMICROELECTRONICS (MALTA) LTD

Inventor： Roberto BRIOSCHI ,  Paul Anthony BARBARA

IPC: H04R1/04 ,  B81B7/00 ,  H04R19/00 ,  H04R19/04 ,  H04R31/00

Abstract: A microelectromechanical microphone includes: a substrate; a sensor chip, integrating a microelectromechanical electroacoustic transducer; and a control chip operatively coupled to the sensor chip. In one embodiment, the sensor chip and the control chip are bonded to the substrate, and the sensor chip overlies, or at least partially overlies, the control chip. In another embodiment, the sensor is bonded to the substrate and a barrier is located around at least a portion of the sensor chip.

公开(公告)号：US20190141426A1

公开(公告)日：2019-05-09

申请号：US16235927

申请日：2018-12-28

Applicant: STMICROELECTRONICS S.R.L. ,  STMICROELECTRONICS (MALTA) LTD

Inventor： Roberto BRIOSCHI ,  Paul Anthony BARBARA

IPC: H04R1/04 ,  B81B7/00 ,  H04R31/00 ,  H04R19/00 ,  H04R19/04

Abstract: A microelectromechanical microphone includes: a substrate; a sensor chip, integrating a microelectromechanical electroacoustic transducer; and a control chip operatively coupled to the sensor chip. In one embodiment, the sensor chip and the control chip are bonded to the substrate, and the sensor chip overlies, or at least partially overlies, the control chip. In another embodiment, the sensor is bonded to the substrate and a barrier is located around at least a portion of the sensor chip.

公开(公告)号：US20170006368A1

公开(公告)日：2017-01-05

申请号：US15143207

申请日：2016-04-29

Applicant: STMICROELECTRONICS S.R.L. ,  STMICROELECTRONICS (MALTA) LTD

Inventor： Roberto BRIOSCHI ,  Alex GRITTI ,  Kevin FORMOSA ,  Paul Anthony BARBARA

IPC: H04R1/04 ,  H04R19/04 ,  H04R31/00 ,  B81B7/00

CPC classification number: H04R1/04 ,  B81B7/0061 ,  B81B7/008 ,  B81B2201/0257 ,  B81B2203/0127 ,  B81B2207/012 ,  B81B2207/07 ,  H04R1/06 ,  H04R19/005 ,  H04R19/04 ,  H04R31/00 ,  H04R31/006 ,  H04R2201/003 ,  H04R2499/11

Abstract: A microelectromechanical microphone includes: a substrate; a sensor chip, integrating a microelectromechanical electroacoustic transducer; and a control chip operatively coupled to the sensor chip. In one embodiment, the sensor chip and the control chip are bonded to the substrate, and the sensor chip overlies, or at least partially overlies, the control chip. In another embodiment, the sensor is bonded to the substrate and a barrier is located around at least a portion of the sensor chip.

Abstract translation: 微机电麦克风包括：基板; 传感器芯片，集成了微机电电声换能器; 以及可操作地耦合到所述传感器芯片的控制芯片。 在一个实施例中，传感器芯片和控制芯片被结合到基板，并且传感器芯片覆盖控制芯片或者至少部分覆盖在控制芯片上。 在另一个实施例中，传感器被结合到基板上，并且屏障位于传感器芯片的至少一部分周围。