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公开(公告)号：US20190141426A1
公开(公告)日：2019-05-09
申请号：US16235927
申请日：2018-12-28
Applicant: STMICROELECTRONICS S.R.L. , STMICROELECTRONICS (MALTA) LTD
Inventor： Roberto BRIOSCHI , Paul Anthony BARBARA
Abstract: A microelectromechanical microphone includes: a substrate; a sensor chip, integrating a microelectromechanical electroacoustic transducer; and a control chip operatively coupled to the sensor chip. In one embodiment, the sensor chip and the control chip are bonded to the substrate, and the sensor chip overlies, or at least partially overlies, the control chip. In another embodiment, the sensor is bonded to the substrate and a barrier is located around at least a portion of the sensor chip.
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公开(公告)号：US20170006368A1
公开(公告)日：2017-01-05
申请号：US15143207
申请日：2016-04-29
Applicant: STMICROELECTRONICS S.R.L. , STMICROELECTRONICS (MALTA) LTD
Inventor： Roberto BRIOSCHI , Alex GRITTI , Kevin FORMOSA , Paul Anthony BARBARA
CPC classification number: H04R1/04 , B81B7/0061 , B81B7/008 , B81B2201/0257 , B81B2203/0127 , B81B2207/012 , B81B2207/07 , H04R1/06 , H04R19/005 , H04R19/04 , H04R31/00 , H04R31/006 , H04R2201/003 , H04R2499/11
Abstract: A microelectromechanical microphone includes: a substrate; a sensor chip, integrating a microelectromechanical electroacoustic transducer; and a control chip operatively coupled to the sensor chip. In one embodiment, the sensor chip and the control chip are bonded to the substrate, and the sensor chip overlies, or at least partially overlies, the control chip. In another embodiment, the sensor is bonded to the substrate and a barrier is located around at least a portion of the sensor chip.
Abstract translation: 微机电麦克风包括：基板; 传感器芯片，集成了微机电电声换能器; 以及可操作地耦合到所述传感器芯片的控制芯片。 在一个实施例中，传感器芯片和控制芯片被结合到基板，并且传感器芯片覆盖控制芯片或者至少部分覆盖在控制芯片上。 在另一个实施例中，传感器被结合到基板上，并且屏障位于传感器芯片的至少一部分周围。
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公开(公告)号：US20210204049A1
公开(公告)日：2021-07-01
申请号：US17204613
申请日：2021-03-17
Applicant: STMICROELECTRONICS S.R.L. , STMICROELECTRONICS (MALTA) LTD
Inventor： Roberto BRIOSCHI , Paul Anthony BARBARA
Abstract: A microelectromechanical microphone includes: a substrate; a sensor chip, integrating a microelectromechanical electroacoustic transducer; and a control chip operatively coupled to the sensor chip. In one embodiment, the sensor chip and the control chip are bonded to the substrate, and the sensor chip overlies, or at least partially overlies, the control chip. In another embodiment, the sensor is bonded to the substrate and a barrier is located around at least a portion of the sensor chip.
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4.发明申请公开(公告)号：US20160261941A1
公开(公告)日：2016-09-08
申请号：US14943848
申请日：2015-11-17
Applicant: STMICROELECTRONICS S.R.L. , STMICROELECTRONICS (MALTA) LTD
Inventor： Roberto BRIOSCHI , Silvia ADORNO , Kenneth FONK
CPC classification number: H04R1/086 , B81B7/0058 , B81B7/0061 , B81B2201/0257 , B81B2203/0127 , B81B2207/012 , B81B2207/07 , B81C1/00309 , B81C2203/0785 , H01L2224/48137 , H01L2224/48227 , H04R19/005 , H04R19/04 , H04R31/00 , H04R31/006
Abstract: A semiconductor integrated device, comprising: a package defining an internal space and having an acoustic-access opening in acoustic communication with an environment external to the package; a MEMS acoustic transducer, housed in the internal space and provided with an acoustic chamber facing the acoustic-access opening; and a filtering module, which is designed to inhibit passage of contaminating particles having dimensions larger than a filtering dimension and is set between the MEMS acoustic transducer and the acoustic-access opening. The filtering module defines at least one direct acoustic path between the acoustic-access opening and the acoustic chamber.
Abstract translation: 一种半导体集成器件，包括：限定内部空间并且具有与所述封装外部的环境声学连通的声学通路开口的封装; MEMS声学换能器，其容纳在内部空间中并且设置有面向声学进入开口的声学室; 以及过滤模块，其设计成抑制具有大于过滤尺寸的尺寸的污染颗粒的通过并设置在MEMS声学换能器和声学通路开口之间。 滤波模块限定声学通道开口和声学室之间的至少一个直接声路径。
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Patent Agency Ranking
公开(公告)号：US20190127218A1
公开(公告)日：2019-05-02
申请号：US16233682
申请日：2018-12-27
Applicant: STMICROELECTRONICS S.R.L.
Inventor： Marco Omar GHIDONI , Roberto BRIOSCHI
CPC classification number: B81B7/02 , B81B7/0061 , B81B2201/0257 , B81B2207/012 , B81B2207/05 , B81B2207/07 , B81B2207/092 , B81B2207/096 , B81C1/0023 , H04R1/04 , H04R1/406 , H04R19/005 , H04R2201/003
Abstract: A transducer module, comprising: a supporting substrate, having a first side and a second side; a cap, which extends over the first side of the supporting substrate and defines therewith a first chamber and a second chamber internally isolated from one another; a first transducer in the first chamber; a second transducer in the second chamber; and a control chip, which extends at least partially in the first chamber and/or in the second chamber and is functionally coupled to the first and second transducers for receiving, in use, the signals transduced by the first and second transducers.
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公开(公告)号：US20170313579A1
公开(公告)日：2017-11-02
申请号：US15362556
申请日：2016-11-28
Applicant: STMICROELECTRONICS S.R.L.
Inventor： Marco Omar GHIDONI , Roberto BRIOSCHI
CPC classification number: B81B7/02 , B81B7/0061 , B81B2201/0257 , B81B2207/012 , B81B2207/05 , B81B2207/07 , B81B2207/092 , B81B2207/096 , B81C1/0023 , H04R1/04 , H04R1/406 , H04R19/005 , H04R2201/003
Abstract: A transducer module, comprising: a supporting substrate, having a first side and a second side; a cap, which extends over the first side of the supporting substrate and defines therewith a first chamber and a second chamber internally isolated from one another; a first transducer in the first chamber; a second transducer in the second chamber; and a control chip, which extends at least partially in the first chamber and/or in the second chamber and is functionally coupled to the first and second transducers for receiving, in use, the signals transduced by the first and second transducers.
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7.发明申请公开(公告)号：US20170235128A1
公开(公告)日：2017-08-17
申请号：US15264446
申请日：2016-09-13
Applicant: STMICROELECTRONICS S.R.L.
Inventor： Roberto BRIOSCHI
CPC classification number: G02B26/101 , B81B7/008 , B81B2201/042 , B81C2203/07 , G02B26/0833 , G02B26/0841
Abstract: The mirror group is formed by a monolithic frame bent along a bending line and including a first and a second supporting portions carrying, respectively, a first and a second chips forming two micromirrors made using MEMS technology. The first and second supporting portions are arranged on opposite sides of the bending line of the frame, angularly inclined with respect to each other. The mirror group is obtained by separating a shaped metal tape carrying a plurality of frames, having flexible electric connection elements. After attaching the chips, the frames are precut, bent along the bending line, and separated.
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8.发明申请公开(公告)号：US20170318396A1
公开(公告)日：2017-11-02
申请号：US15377627
申请日：2016-12-13
Applicant: STMICROELECTRONICS S.R.L.
Inventor： Roberto BRIOSCHI , Marco Omar GHIDONI
CPC classification number: H04R19/04 , B06B1/0292 , B81B7/04 , B81B2201/0235 , B81B2201/0242 , B81B2201/0257 , B81B2201/0264 , B81B2201/0292 , B81B2201/047 , B81B2207/012 , B81B2207/07 , B81C1/0023 , B81C2203/0792 , H01L2224/48091 , H01L2224/48137 , H01L2924/15151 , H04R1/44 , H04R3/005 , H04R7/06 , H04R19/005 , H04R31/003 , H04R31/006 , H04R2201/003 , H04R2499/11 , H01L2924/00014
Abstract: A multi-device module, comprising: a first substrate, which houses a first MEMS transducer, designed to transduce a first environmental quantity into a first electrical signal, and an integrated circuit, coupled to the first MEMS transducer for receiving the first electrical signal; a second substrate, which houses a second MEMS transducer, designed to transduce a second environmental quantity into a second electrical signal; and a flexible printed circuit, mechanically connected to the first and second substrates and electrically coupled to the integrated circuit and to the second MEMS transducer so that the second electrical signal flows, in use, from the second MEMS transducer to the integrated circuit.
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公开(公告)号：US20170311446A1
公开(公告)日：2017-10-26
申请号：US15253615
申请日：2016-08-31
Applicant: STMICROELECTRONICS, INC. , STMICROELECTRONICS S.R.L.
Inventor： Simon DODD , Roberto BRIOSCHI
CPC classification number: H05K1/181 , B81C1/0023 , H01L2924/1461 , H05K1/0272 , H05K1/0293 , H05K1/0306 , H05K1/111 , H05K3/10 , H05K3/4007 , H05K2201/0175 , H05K2201/0338 , H05K2201/0391 , H05K2201/09727 , H05K2201/09763 , H05K2201/09827 , H05K2201/10083 , H05K2201/10159 , H05K2201/10181 , H05K2203/171 , H05K2203/175
Abstract: The present disclosure is directed to a ceramic substrate that includes a plurality of contact pads, a plurality of electrical traces, and a microelectromechanical die. Contacts on the die are coupled to the plurality of contact pads through the plurality of electrical traces. The substrate also includes a plurality of memory bits formed directly on the substrate. Each memory bit is coupled between a first one of the contact pads and a second one of the contact pads.
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