公开(公告)号：US20230356999A1

公开(公告)日：2023-11-09

申请号：US18308562

申请日：2023-04-27

Applicant: STMICROELECTRONICS S.r.l.

Inventor： Filippo DANIELE ,  Lorenzo BALDO ,  Davide MAERNA ,  Enri DUQI

IPC: B81B7/00

CPC classification number: B81B7/0048 ,  B81B7/008

Abstract: A microelectromechanical device includes a support structure, a microelectromechanical system die, incorporating a microstructure and a connection structure between the microelectromechanical system die and the support structure. The connection structure includes a spacer structure, joined to the support structure, and a film applied to one face of the spacer structure opposite to the support structure. The spacer structure laterally delimits at least in part a cavity and the film extends on the cavity, at a distance from the support structure. The microelectromechanical system die is joined to the film on the cavity.

公开(公告)号：US20230280227A1

公开(公告)日：2023-09-07

申请号：US18171184

申请日：2023-02-17

Applicant: STMICROELECTRONICS S.r.l.

Inventor： Enri DUQI ,  Filippo DANIELE ,  Lorenzo BALDO ,  Giulio CAPELLI ,  Salvatore ALONGI

IPC: G01L19/04 ,  G01L9/00 ,  G01L19/00

CPC classification number: G01L19/04 ,  G01L9/0041 ,  G01L19/0092

Abstract: A pressure sensor device is provided with: a pressure detection structure made in a first die of semiconductor material; a package, configured to internally accommodate the pressure detection structure in an impermeable manner, the package having a base structure and a body structure, arranged on the base structure, with an access opening in contact with an external environment and internally defining a housing cavity, in which the first die is arranged covered with a coating material. The pressure sensor device is also provided with a heating structure, accommodated in the housing cavity and for allowing heating of the pressure detection structure from the inside of the package.