公开(公告)号：US20240140783A1

公开(公告)日：2024-05-02

申请号：US18489729

申请日：2023-10-18

Applicant: STMICROELECTRONICS S.r.l.

Inventor： Mark Andrew SHAW ,  Lorenzo CORSO ,  Matteo GARAVAGLIA ,  Giorgio ALLEGATO

IPC: B81B7/00 ,  B81C1/00

CPC classification number: B81B7/0074 ,  B81C1/0023 ,  B81B2207/012 ,  B81C2203/0792

Abstract: A device and method for manufacturing a device comprising two semiconductor dice. The device is formed by a first die and a second die. The first die is of semiconductor material and integrates electronic components. The second die has a main surface, forms patterned structures, and is bonded to the first die. Internal electrical coupling structures electrically couple the main surface of the first die to the second die. External connection regions extend on the main surface of the first die. A package packages the first die, the second die and the internal electrical coupling structures and partially surrounds the external connection regions, the external connection regions partially protruding from the package.

公开(公告)号：US20240043265A1

公开(公告)日：2024-02-08

申请号：US18359754

申请日：2023-07-26

Applicant: STMICROELECTRONICS S.r.l.

Inventor： Giorgio ALLEGATO ,  Silvia NICOLI ,  Anna ALESSANDRI ,  Matteo GARAVAGLIA

IPC: B81B7/00 ,  B81C1/00

CPC classification number: B81B7/0022 ,  B81C1/00269 ,  B81B2201/0228 ,  B81B2203/0315 ,  B81B2207/053 ,  B81C2203/0154 ,  B81C2203/0109 ,  B81C2203/038

Abstract: Electronic device including: a MEMS sensor device including a functional structure which transduces a chemical or physical quantity into a corresponding electrical quantity; a cap including a semiconductive substrate; and a bonding dielectric region, which mechanically couples the cap to the MEMS sensor device. The cap further includes a conductive region, which extends between the semiconductive substrate and the MEMS sensor device and includes: a first portion, which is arranged laterally with respect to the semiconductive substrate and is exposed, so as to be electrically coupleable to a terminal at a reference potential by a corresponding wire bonding; and a second portion, which contacts the semiconductive substrate.

公开(公告)号：US20170369309A1

公开(公告)日：2017-12-28

申请号：US15379091

申请日：2016-12-14

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Giorgio ALLEGATO ,  Laura OGGIONI ,  Matteo GARAVAGLIA ,  Roberto SOMASCHINI

IPC: B81C1/00 ,  B81B3/00

CPC classification number: B81C1/00269 ,  B81B3/0097 ,  B81B2201/0242 ,  B81B2201/0264 ,  B81B2201/042 ,  B81B2203/0315 ,  B81C3/001 ,  B81C2201/019 ,  B81C2203/0118 ,  B81C2203/019 ,  B81C2203/037

Abstract: A microelectromechanical device having a first substrate of semiconductor material and a second substrate of semiconductor material having a bonding recess delimited by projecting portions, monolithic therewith. The bonding recess forms a closed cavity with the first substrate. A bonding structure is arranged within the closed cavity and is bonded to the first and second substrates. A microelectromechanical structure is formed in a substrate chosen between the first and second substrates. The device is manufactured by forming the bonding recess in a first wafer; depositing a bonding mass in the bonding recess, the bonding mass having a greater depth than the bonding recess; and bonding the two wafers.