公开(公告)号：US20140027933A1

公开(公告)日：2014-01-30

申请号：US14038574

申请日：2013-09-26

Applicant: STMicroelectronics, Inc.

Inventor： John H. Zhang ,  Walter Kleemeier ,  Paul Ferreira ,  Ronald K. Sampson

IPC: H01L23/544 ,  H01L21/66

CPC classification number: H01L23/544 ,  H01L22/14 ,  H01L22/22 ,  H01L22/34 ,  H01L25/0657 ,  H01L25/50 ,  H01L2223/54426 ,  H01L2223/54453 ,  H01L2223/5446 ,  H01L2224/16 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06593 ,  H01L2924/1461 ,  H01L2924/00

Abstract: A device is provided that includes a first die having a first alignment structure that includes a plurality of first transmission columns arranged in a pattern and a second die positioned on the first die, the second die having a second alignment structure that includes a plurality of second transmission columns arranged in the same pattern as the first transmission columns. The first and second transmission columns are each coplanar with a first surface and a second surface of the first and second die, respectively.

Abstract translation: 提供了一种装置，其包括具有第一对准结构的第一管芯，所述第一对准结构包括布置成图案的多个第一传输柱和位于所述第一管芯上的第二管芯，所述第二管芯具有第二对准结构，所述第二对准结构包括多个第二 传输列以与第一传输列相同的图案排列。 第一和第二透射柱分别与第一和第二模具的第一表面和第二表面共面。

公开(公告)号：US11205621B2

公开(公告)日：2021-12-21

申请号：US16808090

申请日：2020-03-03

Applicant: STMICROELECTRONICS, INC.

Inventor： John H. Zhang ,  Walter Kleemeier ,  Paul Ferreira ,  Ronald K. Sampson

IPC: H01L23/544 ,  H01L21/66 ,  H01L25/065 ,  H01L25/00

Abstract: A device is provided that includes a first die having a first alignment structure that includes a plurality of first transmission columns arranged in a pattern and a second die positioned on the first die, the second die having a second alignment structure that includes a plurality of second transmission columns arranged in the same pattern as the first transmission columns. The first and second transmission columns are each coplanar with a first surface and a second surface of the first and second die, respectively.

公开(公告)号：US09870999B2

公开(公告)日：2018-01-16

申请号：US14951050

申请日：2015-11-24

Applicant: STMicroelectronics, Inc.

Inventor： John H. Zhang ,  Walter Kleemeier ,  Paul Ferreira ,  Ronald K. Sampson

IPC: H01L23/544 ,  H01L21/66 ,  H01L25/065 ,  H01L25/00

CPC classification number: H01L23/544 ,  H01L22/14 ,  H01L22/22 ,  H01L22/34 ,  H01L25/0657 ,  H01L25/50 ,  H01L2223/54426 ,  H01L2223/54453 ,  H01L2223/5446 ,  H01L2224/16 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06593 ,  H01L2924/1461 ,  H01L2924/00

Abstract: A device is provided that includes a first die having a first alignment structure that includes a plurality of first transmission columns arranged in a pattern and a second die positioned on the first die, the second die having a second alignment structure that includes a plurality of second transmission columns arranged in the same pattern as the first transmission columns. The first and second transmission columns are each coplanar with a first surface and a second surface of the first and second die, respectively.

公开(公告)号：US09324660B2

公开(公告)日：2016-04-26

申请号：US14038574

申请日：2013-09-26

Applicant: STMicroelectronics, Inc.

Inventor： John H. Zhang ,  Walter Kleemeier ,  Paul Ferreira ,  Ronald K. Sampson

IPC: H01L23/544 ,  H01L21/66 ,  H01L25/065 ,  H01L25/00

CPC classification number: H01L23/544 ,  H01L22/14 ,  H01L22/22 ,  H01L22/34 ,  H01L25/0657 ,  H01L25/50 ,  H01L2223/54426 ,  H01L2223/54453 ,  H01L2223/5446 ,  H01L2224/16 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06593 ,  H01L2924/1461 ,  H01L2924/00

Abstract: A device is provided that includes a first die having a first alignment structure that includes a plurality of first transmission columns arranged in a pattern and a second die positioned on the first die, the second die having a second alignment structure that includes a plurality of second transmission columns arranged in the same pattern as the first transmission columns. The first and second transmission columns are each coplanar with a first surface and a second surface of the first and second die, respectively.