公开(公告)号：US10141246B2

公开(公告)日：2018-11-27

申请号：US15952068

申请日：2018-04-12

申请人： STMicroelectronics, Inc.

发明人： Jefferson Talledo ,  Tito Mangaoang

IPC分类号： H01L21/44 ,  H01L23/495 ,  H01L23/00 ,  H01L21/78 ,  H01L21/56 ,  H01L21/48 ,  H01L23/31

摘要： The present disclosure is directed to a leadframe package having a side solder ball contact and methods of manufacturing the same. A plurality of solder balls are coupled to recesses in a leadframe before encapsulation and singulation. After singulation, a portion of each solder ball is exposed on sidewalls of the package. This ensures that the sidewalls of the leads are solder wettable, which allows for the formation of stronger joints when the package is coupled to a substrate. This increased adhesion reduces resistance at the joints and also mitigates the effects of expansion of the components in the package such that delamination is less likely to occur. As a result, packages with a side solder ball contact have increased life cycle expectancies.

公开(公告)号：US09972558B1

公开(公告)日：2018-05-15

申请号：US15479068

申请日：2017-04-04

申请人： STMicroelectronics, Inc.

发明人： Jefferson Talledo ,  Tito Mangaoang

IPC分类号： H01L23/495 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56 ,  H01L21/78 ,  H01L23/00

CPC分类号： H01L23/4952 ,  H01L21/4832 ,  H01L21/561 ,  H01L23/3107 ,  H01L23/49582 ,  H01L24/09 ,  H01L24/11 ,  H01L24/17 ,  H01L24/27 ,  H01L24/32 ,  H01L24/46 ,  H01L24/92 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/92125

摘要： The present disclosure is directed to a leadframe package having a side solder ball contact and methods of manufacturing the same. A plurality of solder balls are coupled to recesses in a leadframe before encapsulation and singulation. After singulation, a portion of each solder ball is exposed on sidewalls of the package. This ensures that the sidewalls of the leads are solder wettable, which allows for the formation of stronger joints when the package is coupled to a substrate. This increased adhesion reduces resistance at the joints and also mitigates the effects of expansion of the components in the package such that delamination is less likely to occur. As a result, packages with a side solder ball contact have increased life cycle expectancies.

公开(公告)号：US11658098B2

公开(公告)日：2023-05-23

申请号：US17073190

申请日：2020-10-16

申请人： STMICROELECTRONICS, INC.

发明人： Jefferson Talledo ,  Tito Mangaoang

IPC分类号： H01L23/495 ,  H01L23/00 ,  H01L21/48 ,  H01L21/56 ,  H01L21/78 ,  H01L23/31

CPC分类号： H01L23/4952 ,  H01L21/4825 ,  H01L21/4828 ,  H01L21/4832 ,  H01L21/563 ,  H01L21/78 ,  H01L23/3121 ,  H01L23/49548 ,  H01L23/49582 ,  H01L24/09 ,  H01L24/11 ,  H01L24/17 ,  H01L24/27 ,  H01L24/32 ,  H01L24/46 ,  H01L24/92 ,  H01L21/561 ,  H01L23/3107 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/92125 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/73265 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2924/00

摘要： The present disclosure is directed to a leadframe package having a side solder ball contact and methods of manufacturing the same. A plurality of solder balls are coupled to recesses in a leadframe before encapsulation and singulation. After singulation, a portion of each solder ball is exposed on sidewalls of the package. This ensures that the sidewalls of the leads are solder wettable, which allows for the formation of stronger joints when the package is coupled to a substrate. This increased adhesion reduces resistance at the joints and also mitigates the effects of expansion of the components in the package such that delamination is less likely to occur. As a result, packages with a side solder ball contact have increased life cycle expectancies.

公开(公告)号：US20190074241A1

公开(公告)日：2019-03-07

申请号：US16174031

申请日：2018-10-29

申请人： STMicroelectronics, Inc.

发明人： Jefferson Talledo ,  Tito Mangaoang

IPC分类号： H01L23/495 ,  H01L23/00 ,  H01L21/48 ,  H01L21/56 ,  H01L21/78 ,  H01L23/31

摘要： The present disclosure is directed to a leadframe package having a side solder ball contact and methods of manufacturing the same. A plurality of solder balls are coupled to recesses in a leadframe before encapsulation and singulation. After singulation, a portion of each solder ball is exposed on sidewalls of the package. This ensures that the sidewalls of the leads are solder wettable, which allows for the formation of stronger joints when the package is coupled to a substrate. This increased adhesion reduces resistance at the joints and also mitigates the effects of expansion of the components in the package such that delamination is less likely to occur. As a result, packages with a side solder ball contact have increased life cycle expectancies.