公开(公告)号：US10075694B2

公开(公告)日：2018-09-11

申请号：US15681135

申请日：2017-08-18

Applicant: STMicroelectronics (Crolles 2) SAS

Inventor： Alexandre Ayres ,  Bertrand Borot

IPC: H01L23/522 ,  H04N13/00 ,  G11C5/04 ,  G11C29/44 ,  B42D25/42 ,  B42D25/305

CPC classification number: H04N13/178 ,  B42D25/305 ,  B42D25/42 ,  G11C5/04 ,  G11C29/44 ,  H01L23/544 ,  H01L25/0657 ,  H01L27/0688 ,  H01L2223/54413 ,  H01L2223/5442 ,  H01L2223/5444 ,  H01L2223/54473

Abstract: A semiconductor chip includes a plurality of superposed semiconductor levels. The semiconductor levels include a plurality of elementary circuits coupled to a common input node. Sensing circuits are coupled to elementary elements of different levels. The outputs of the sensing circuits are used to generate a number, which serves as an identification number of the semiconductor chip.

公开(公告)号：US11251175B2

公开(公告)日：2022-02-15

申请号：US16562963

申请日：2019-09-06

Applicant: STMicroelectronics (Crolles 2) SAS

Inventor： Alexandre Ayres ,  Bertrand Borot

IPC: H01L27/32 ,  H01L27/02 ,  G06F30/39 ,  G06F30/394 ,  H01L23/522 ,  H01L23/528 ,  H01L23/532 ,  H01L27/088

Abstract: A three-dimensional integrated structure is formed by a first substrate with first components oriented in a first direction and a second substrate with second components oriented in a second direction. An interconnection level includes electrically conducting tracks that run in a third direction. One of the second direction and third direction forms a non-right and non-zero angle with the first direction. An electrical link formed by at least one of the electrically conducting tracks electrically connected two points of the first or of the second components.

公开(公告)号：US10446535B2

公开(公告)日：2019-10-15

申请号：US15137201

申请日：2016-04-25

Applicant: STMicroelectronics (Crolles 2) SAS

Inventor： Alexandre Ayres ,  Bertrand Borot

IPC: H01L23/48 ,  H01L27/02 ,  G06F17/50 ,  H01L23/522 ,  H01L23/528 ,  H01L23/532 ,  H01L27/088

Abstract: A three-dimensional integrated structure is formed by a first substrate with first components oriented in a first direction and a second substrate with second components oriented in a second direction. An interconnection level includes electrically conducting tracks that run in a third direction. One of the second direction and third direction forms a non-right and non-zero angle with the first direction. An electrical link formed by at least one of the electrically conducting tracks electrically connected two points of the first or of the second components.

公开(公告)号：US11573260B2

公开(公告)日：2023-02-07

申请号：US17543337

申请日：2021-12-06

Applicant: STMicroelectronics (Crolles 2) SAS

Inventor： Alexandre Ayres ,  Bertrand Borot

IPC: G01R31/28

Abstract: An integrated circuit chip is attached to a support that includes first conductive elements. First conductive pads are located on the integrated circuit chip and are electrically coupled to the first conductive elements by conductive wires. The integrated circuit chip further includes a conductive track. A switch circuit is provided to selectively electrically connect each first conductive pad to the conductive track. To test the conductive wires, a group of first conductive pads are connected by their respective switch circuits to the conductive track and current flow between corresponding first conductive elements is measured.

公开(公告)号：US20170179104A1

公开(公告)日：2017-06-22

申请号：US15137201

申请日：2016-04-25

Applicant: STMicroelectronics (Crolles 2) SAS

Inventor： Alexandre Ayres ,  Bertrand Borot

IPC: H01L27/02 ,  H01L23/532 ,  H01L27/088 ,  H01L23/522 ,  H01L23/528

CPC classification number: H01L27/0207 ,  G06F17/5068 ,  G06F17/5077 ,  H01L23/5226 ,  H01L23/528 ,  H01L23/53228 ,  H01L27/088

Abstract: A three-dimensional integrated structure is formed by a first substrate with first components oriented in a first direction and a second substrate with second components oriented in a second direction. An interconnection level includes electrically conducting tracks that run in a third direction. One of the second direction and third direction forms a non-right and non-zero angle with the first direction. An electrical link formed by at least one of the electrically conducting tracks electrically connected two points of the first or of the second components.