公开(公告)号：US20230223277A1

公开(公告)日：2023-07-13

申请号：US18094775

申请日：2023-01-09

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Fanny LAPORTE ,  Ludovic FOURNEAUD ,  Eric SAUGIER

IPC: H01L21/48 ,  H01L23/13 ,  H01L23/498

CPC classification number: H01L21/4857 ,  H01L21/486 ,  H01L23/13 ,  H01L23/49838 ,  H01L24/48

Abstract: An integrated circuit chip carrier includes a wall surrounding a cavity. The wall includes one or more levels where each level is formed from a layer of a resin around a block. The block is made of a material different from the resin. The block is removed to open the cavity.

公开(公告)号：US20230187118A1

公开(公告)日：2023-06-15

申请号：US18074813

申请日：2022-12-05

Applicant: STMicroelectronics (Grenoble 2) SAS ,  STMicroelectronics (Tours) SAS

Inventor： Ludovic FOURNEAUD ,  Laurent MOINDRON ,  Gregory BOUTELOUP

IPC: H01F27/28 ,  H01F27/02 ,  H01F41/04 ,  H01L23/498 ,  H01L23/31

CPC classification number: H01F27/2804 ,  H01F27/022 ,  H01F41/041 ,  H01L23/3107 ,  H01L23/49822 ,  H01L28/10

Abstract: An integrated circuit device includes at least one inductive component with at least one integrated metal winding that is at least partially embedded in a coating. The coating includes at least one ferromagnetic material. The coating optionally includes a non-magnetic material, for example a dielectric.

公开(公告)号：US20220200117A1

公开(公告)日：2022-06-23

申请号：US17552595

申请日：2021-12-16

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Ludovic FOURNEAUD ,  Gregory BOUTELOUP ,  Jerome LOPEZ

IPC: H01P3/08 ,  H05K1/02 ,  H05K1/11 ,  H05K1/03

Abstract: A device for transmission of at least one high-frequency signal includes at least one first electrically-conductive track formed inside and/or on top of a flexible substrate.