公开(公告)号：US20150183637A1

公开(公告)日：2015-07-02

申请号：US14587324

申请日：2014-12-31

Applicant: STMICROELECTRONICS (SHENZHEN) R&D CO., LTD.

Inventor： Jing-En LUAN

IPC: B81B7/00 ,  B81C1/00

CPC classification number: B81C1/0023 ,  B81B7/007 ,  H01L24/97 ,  H01L2224/32145 ,  H01L2224/48095 ,  H01L2224/48145 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00

Abstract: An electronic device may include first and second laterally spaced apart interconnect substrates defining a slotted opening, and a first IC in the slotted opening and electrically coupled to one or more of the first and second interconnect substrates. The electronic device may include a first other IC over the first IC and electrically coupled to one or more of the first and second interconnect substrates, and encapsulation material over the first and second interconnect substrates, the first IC, and the first other IC.

Abstract translation: 电子设备可以包括限定开槽开口的第一和第二横向间隔开的互连基板，以及开槽开口中的第一IC，并且电耦合到第一和第二互连基板中的一个或多个。 电子器件可以包括位于第一IC上的第一其它IC，并且电耦合到第一和第二互连衬底中的一个或多个，以及在第一和第二互连衬底，第一IC和第一其他IC上的封装材料。

公开(公告)号：US20150145110A1

公开(公告)日：2015-05-28

申请号：US14553799

申请日：2014-11-25

Applicant: STMicroelectronics (Shenzhen) R&D Co., Ltd.

Inventor： Jing-En LUAN

IPC: H01L23/00 ,  H01L21/82 ,  H01L21/56 ,  H01L23/495 ,  H01L23/28

CPC classification number: H01L24/83 ,  H01L21/561 ,  H01L23/3107 ,  H01L23/49524 ,  H01L23/49551 ,  H01L23/49562 ,  H01L24/29 ,  H01L24/32 ,  H01L24/37 ,  H01L24/40 ,  H01L24/73 ,  H01L24/84 ,  H01L24/92 ,  H01L24/97 ,  H01L2224/29111 ,  H01L2224/32245 ,  H01L2224/37147 ,  H01L2224/40095 ,  H01L2224/40245 ,  H01L2224/40499 ,  H01L2224/73263 ,  H01L2224/83801 ,  H01L2224/84801 ,  H01L2224/92246 ,  H01L2224/97 ,  H01L2924/181 ,  H01L2924/01082 ,  H01L2924/00014 ,  H01L2924/0105 ,  H01L2924/014 ,  H01L2224/83 ,  H01L2224/84 ,  H01L2924/00012

Abstract: Embodiments of the present disclosure relate to a leadless surface mount assembly package, an electronic device, and a method for forming a surface mount assembly package, which package comprising: a first lead; a second lead; a chip fixed on an upper surface of the first lead; a clip coupled to the second lead, a lower surface of the clip being fixed to an upper surface of the chip. The surface mount assembly package further comprises a molding compound for molding the first lead, the second lead, the chip, and the clip, wherein ends of the first lead and the second lead are only exposed from the molding compound, without outward extending from the molding compound. By using the embodiments of the present disclosure, costs can be saved and processing flow can be simplified, and a new-model leadless surface mount assembly package is obtained.

Abstract translation: 本公开的实施例涉及无引线表面安装组件封装，电子器件和用于形成表面安装组件封装的方法，该封装包括：第一引线; 第二个领先; 固定在所述第一引线的上表面上的芯片; 夹子，其联接到所述第二引线，所述夹子的下表面固定到所述芯片的上表面。 表面安装组件封装还包括用于模制第一引线，第二引线，芯片和夹子的模制化合物，其中第一引线和第二引线的端部仅从模制化合物暴露而不向外延伸 模塑料。 通过使用本公开的实施例，可以节省成本并且可以简化处理流程，并且获得新型无引线表面安装组件封装。