公开(公告)号：US20240426652A1

公开(公告)日：2024-12-26

申请号：US18742355

申请日：2024-06-13

Applicant: STMicroelectronics International N.V.

Inventor： Gianluca LONGONI ,  Luca SEGHIZZI ,  Francesco BIANCHI ,  Federico VERCESI ,  Andrea NOMELLINI ,  Silvia NICOLI

IPC: G01H11/08 ,  G01P15/08 ,  H04R1/08 ,  H04R7/04 ,  H04R7/18 ,  H04R17/02 ,  H04R31/00

Abstract: A microelectromechanical sensor assembly includes a semiconductor die having a scaled cavity. A microelectromechanical inertial sensor has a sensing mass. A piezoelectric vibration sensor has a piezoelectric membrane. The sensing mass and the piezoelectric membrane are stacked one on top of the other and housed in the sealed cavity.