公开(公告)号：US20180053861A1

公开(公告)日：2018-02-22

申请号：US15802271

申请日：2017-11-02

Applicant: STMicroelectronics Pte Ltd. ,  STMicroelectronics R&D Limited

Inventor： Yonggang JIN ,  David LAWSON ,  Colin CAMPBELL ,  Anandan RAMASAMY

IPC: H01L31/0216 ,  H01L31/0232 ,  H01L31/0203 ,  H01L31/101 ,  H01L31/02

CPC classification number: H01L31/02165 ,  H01L31/02005 ,  H01L31/0203 ,  H01L31/02162 ,  H01L31/02164 ,  H01L31/02327 ,  H01L31/1013 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/00014

Abstract: Embodiments of the present disclosure are directed to optical packages having a package body that includes a light protection coating on at least one surface of a transparent material. The light protection coating includes one or more openings to allow light to be transmitted to the optical device within the package body. In one embodiment, the light protection coating and the openings allow substantially perpendicular radiation to be directed to the optical device within the package body. In one exemplary embodiment the light protection coating is located on an outer surface of the transparent material. In another embodiment, the light protection coating is located on an inner surface of the transparent material inside of the package body.