公开(公告)号：US20030122249A1

公开(公告)日：2003-07-03

申请号：US10298189

申请日：2002-11-14

Applicant: STMICROELECTRONICS S.A.

Inventor： Christophe Prior

IPC: H01L023/32

CPC classification number: H01L27/14618 ,  H01L24/32 ,  H01L24/83 ,  H01L31/0203 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/12043 ,  H01L2924/16195 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A semiconductor package is provided that includes an electrical connection and support means having a front face and a recess in the front face. The semiconductor package also includes a semiconductor component having a front face including a sensor and a rear face which presses on the bottom of the recess of the electrical connection and support means. Further included in the semiconductor package is a positioning and locking means for locking the semiconductor component onto the electrical connection and support means. The positioning and locking means is engaged in a space which separates the periphery of the semiconductor component from the periphery of the recess and keeps the semiconductor component pressed against the bottom of the recess. Thus, there is provided a semiconductor package having efficiently oriented components.

Abstract translation: 提供一种半导体封装，其包括电连接和支撑装置，其具有正面和前表面中的凹部。 半导体封装还包括半导体部件，其具有包括传感器的前表面和压在电连接和支撑装置的凹部的底部上的后表面。 还包括在半导体封装中的是用于将半导体部件锁定到电连接和支撑装置上的定位和锁定装置。 定位和锁定装置接合在将半导体部件的周边与凹部的周边分开的空间中，并使半导体部件压靠在凹部的底部。 因此，提供了具有有效取向的部件的半导体封装。

公开(公告)号：US20020101006A1

公开(公告)日：2002-08-01

申请号：US09775410

申请日：2001-02-01

Applicant: STMicroelectronics S.A.

Inventor： Christophe Prior

IPC: B29C070/72

CPC classification number: B29C70/72 ,  B29C45/14655 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/12033 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/0401

Abstract: An injection-molding mold having two parts adapted to take up between them the periphery of a substrate and one of which defines a molding cavity connected to means for feeding a coating material for encapsulating a row of spaced integrated circuit chips carried by a mounting face of said substrate and placed in said cavity, characterized in that the part (10) with cavities (14) includes a slot (17) for injecting the coating material into said cavity above the mounting face (2) of the substrate, recessed into its face (12) bearing on the substrate (1) along said row of chips and extending approximately the whole length of that row of chips.

Abstract translation: 一种注射成型模具，其具有两个部分，其适于在它们之间吸收基底的周边，并且其中一个限定了模制腔，所述模腔连接到用于馈送涂覆材料的装置，所述模制腔用于封装一排间隔开的集成电路芯片， 所述衬底放置在所述空腔中，其特征在于，具有空腔（14）的部分（10）包括用于将涂层材料注入到衬底的安装面（2）上方的空腔中的凹槽（17） （12）沿着所述排的芯片承载在基板（1）上并且大致延伸该行芯片的整个长度。