公开(公告)号：US20030038338A1

公开(公告)日：2003-02-27

申请号：US10179462

申请日：2002-06-25

Applicant: STMicroelectronics S.A.

Inventor： Richard Fournel ,  Norbert Colombet ,  Phillippe Candelier

IPC: H01L029/00

CPC classification number: H01L23/5258 ,  H01L23/3672 ,  H01L23/3677 ,  H01L23/525 ,  H01L23/552 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A semiconductor device includes multiple layers of integrated electronic components, and at least one electrical connection strip defining a fusible strip in one of the layers. An end of the fusible strip is connected to an integrated electronic component. An intermediate electrical connection and heat dissipation structure and a screen are disposed between the fusible strip and the integrated electronic component.

Abstract translation: 半导体器件包括多层集成电子元件，以及至少一个电连接条，其在层之一中限定可熔条。 可熔条的端部连接到集成电子部件。 中间电气连接和散热结构和屏幕设置在可熔条和集成电子部件之间。