Abstract:
An integrated circuit having as power supply voltages a low voltage reference, a logic supply voltage reference and a high voltage reference is provided. The high voltage reference is greater than the low voltage reference and the logic supply voltage reference. The integrated circuit includes an electrically programmable non-volatile memory element, and a selection and programming circuit connected thereto. A voltage control device is connected to a power supply input node of the selection and programming circuit for applying, based upon a programming control signal, the high voltage reference for programming the electrically programmable non-volatile memory element or for applying at least one logic supply voltage reference.
Abstract:
A device for detecting the application of a high voltage signal to an internal node of an integrated circuit includes a high-voltage divider circuit and a threshold detection circuit. The threshold detection circuit receives a signal given by the output of the divider circuit, and provides a threshold crossing detection signal at an output thereof based upon the signal crossing a threshold. The detection circuit is connected between the logic supply voltage and ground, and further includes a negative feedback loop. The negative feedback loop is connected to the output of the divider circuit to limit the voltage build-up of the high voltage signal at the output thereof after the crossing of the detection threshold by the signal.
Abstract:
A non-volatile memory includes a floating gate extending in a substrate between source and drain regions. A channel region may be confined by two insulating layers. The invention is particularly applicable to EPROM, EEPROM, Flash and single-electron memories using CMOS technology.
Abstract:
In a reading device for a memory, a circuit for the asymmetrical precharging of the differential amplifier is provided so that an output of the reading device switches over to a determined state. In the following evaluation phase, if the memory cell is programmed, the output remains unchanged. If the memory cell is blank or erased, the output of the reading device switches over to another state. A detection circuit detects a sufficient difference between the inputs of the differential amplifier for stopping the asymmetrical precharging and for making the reading device go automatically to the evaluation phase.
Abstract:
A few times programmable (FTP) storage element is provided. The FTP storage element includes a set of N elementary memory units and multiple selection circuits. Each of the elementary memory units includes an address bus for connection to a main address bus and a data bus for connection to a main data bus. The selection circuits generate successive selection signals for successively selecting one of the elementary memory units in order to give exclusive access to the one selected elementary memory unit. The selection circuits operate so as to automatically select a next one of the elementary memory units upon detection of a predetermined condition. In preferred embodiments, each of the elementary memory units is programmable.
Abstract:
A non-volatile memory architecture with a word-based organization includes one selection transistor per word. This selection transistor is used for the selection of the word by the source of the memory cells. In this way, the selection may be done directly by the output signals from the address decoders using low voltage. The switching of a high voltage to the gates and the drains of the memory cells is done independently of this selection. This enables the required number of high voltage switches to be reduced.
Abstract:
The FAMOS memory location comprises a single floating gate (GR) overlapping an active surface of a semiconductor substrate according to at least two asymmetrical overlap profiles (PF1, PF2) so as to define at least two electrodes in the active region. Memory location programming means (MC, SW) are capable of selectively applying different predetermined sets of bias voltages to the electrodes so as to confer at least three programming logic levels on the memory location.
Abstract:
An FAMOS memory includes memory cells, with each memory cell including an insulated gate transistor, and a first access transistor having a drain connected to a source of the insulated gate transistor. The FAMOS memory also includes an insulation transistor having a drain and a source respectively connected to the source of the insulated gate transistors of two adjacent cells of a same row. Each insulated gate transistor has a ring structure, and a ladder-shaped separation region insulates the cells of the same row.
Abstract:
An integrated circuit receives as supply voltages a ground reference voltage, a logic supply voltage and a high voltage. A protection device is associated with at least one gate oxide circuit element. The protection device applies to a supply node of the circuit element either the logic supply voltage under normal conditions of operation of the integrated circuit, or the high voltage under abnormal conditions of operation of the integrated circuit for breaking down the gate oxide.
Abstract:
An SRAM memory cell includes first and second inverters (14, 16) interconnected between first and second data nodes. Each inverter is formed from complementary MOS transistors (18, 20, 18null, 20null) connected in series between a DC voltage supply source and a grounding circuit (22). A circuit (28, 30) programs the MOS transistors by causing an irreversible degradation of a gate oxide layer of at least some of the transistors (18, 18null).