公开(公告)号：US20160087080A1

公开(公告)日：2016-03-24

申请号：US14949528

申请日：2015-11-23

Applicant: STMicroelectronics S.R.L.

Inventor： Antonio Giuseppe Grimaldi ,  Davide Giuseppe Patti ,  Monica Miccichè ,  Salvatore Liotta ,  Angela Longhitano

IPC: H01L29/66 ,  H01L29/423

CPC classification number: H01L29/66666 ,  H01L27/0629 ,  H01L29/4236 ,  H01L29/42376 ,  H01L29/6609 ,  H01L29/66734 ,  H01L29/7804 ,  H01L29/7813 ,  H01L29/861

Abstract: A VTMOS transistor in semiconductor material of a first type of conductivity includes a body region of a second type of conductivity and a source region of the first type of conductivity. A gate region extends into the main surface through the body region and is insulated from the semiconductor material. A region of the gate region extends onto the main surface is insulated from the rest of the gate region. An anode region of the first type of conductivity is formed into said insulated region, and a cathode region of the second type of conductivity is formed into said insulated region in contact with the anode region; the anode region and the cathode region define a thermal diode electrically insulated from the chip.

Abstract translation: 第一导电类型的半导体材料中的VTMOS晶体管包括第二导电类型的体区和第一类导电性的源区。 栅极区域通过主体区域延伸到主表面并与半导体材料绝缘。 延伸到主表面上的栅极区域的区域与栅极区域的其余部分绝缘。 第一导电类型的阳极区域形成在所述绝缘区域中，并且第二导电类型的阴极区域形成为与阳极区域接触的所述绝缘区域; 阳极区域和阴极区域限定与芯片电绝缘的热二极管。

公开(公告)号：US09673298B2

公开(公告)日：2017-06-06

申请号：US14949528

申请日：2015-11-23

Applicant: STMicroelectronics S.R.L.

Inventor： Antonio Giuseppe Grimaldi ,  Davide Giuseppe Patti ,  Monica Miccichè ,  Salvatore Liotta ,  Angela Longhitano

IPC: H01L21/8234 ,  H01L29/66 ,  H01L29/78 ,  H01L27/06 ,  H01L29/861 ,  H01L29/423

CPC classification number: H01L29/66666 ,  H01L27/0629 ,  H01L29/4236 ,  H01L29/42376 ,  H01L29/6609 ,  H01L29/66734 ,  H01L29/7804 ,  H01L29/7813 ,  H01L29/861

Abstract: A VTMOS transistor in semiconductor material of a first type of conductivity includes a body region of a second type of conductivity and a source region of the first type of conductivity. A gate region extends into the main surface through the body region and is insulated from the semiconductor material. A region of the gate region extends onto the main surface is insulated from the rest of the gate region. An anode region of the first type of conductivity is formed into said insulated region, and a cathode region of the second type of conductivity is formed into said insulated region in contact with the anode region; the anode region and the cathode region define a thermal diode electrically insulated from the chip.