Abstract:
A method of making an integrated circuit (IC) includes forming circuitry over a top surface of a semiconductor substrate having the top surface and an opposite bottom surface. An antenna is formed in an interconnect layer formed above the semiconductor substrate, where the antenna is coupled to circuitry. A seal ring is formed around a periphery of the interconnect layer. The seal ring is disposed around the antenna and the circuitry. A trench with a solid-state insulating material is formed. The trench extends vertically into the semiconductor substrate and extends laterally across the IC.
Abstract:
A power supply circuit for an electrical appliance, including a turning-on stage configured for determining a transition from a turned-off state, in which the power supply circuit is off and does not supply electric power, to a turned-on state of the power supply circuit. The turning-on stage includes a transducer of the remote-control type configured for triggering the transition in response to the reception of a wireless signal. In some embodiments, operating power is transmitted from a remote controller to a control circuit of the electronic equipment, such that the electronic equipment can be turned on remotely but draws zero standby power.