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公开(公告)号：US20180194614A1
公开(公告)日：2018-07-12
申请号：US15915454
申请日：2018-03-08
Applicant: STMicroelectronics Asia Pacific Pte Ltd , STMicroelectronics S.r.l. , STMicroelectronics, Inc.
Inventor： Teck Khim Neo , Mauro Pasetti , Franco Consiglieri , Luca Molinari , Andrea Nicola Colecchia , Simon Dodd
CPC classification number: B81B7/008 , B05B1/24 , B05B17/06 , B41J2/04501 , B41J2/04541 , B41J2/04543 , B41J2/14016 , B41J2/14072 , B81B2201/05 , B81B2207/012 , B81B2207/091
Abstract: The present disclosure is directed to a microfluidic die that includes ejection circuitry and one time programmable memory with a minimal number of contact pads to external devices. The die includes a relatively large number of nozzles and a relatively small number of contact pads. The die includes decoding circuitry that utilizes the small number of contact pads to control the drive and ejection of the nozzles and the reading/writing of the memory with the same contact pads.
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公开(公告)号：US09938136B2
公开(公告)日：2018-04-10
申请号：US15240709
申请日：2016-08-18
Applicant: STMicroelectronics Asia Pacific Pte Ltd , STMicroelectronics S.r.l. , STMicroelectronics, Inc.
Inventor： Teck Khim Neo , Mauro Pasetti , Franco Consiglieri , Luca Molinari , Andrea Nicola Colecchia , Simon Dodd
CPC classification number: B81B7/008 , B05B1/24 , B05B17/06 , B41J2/04501 , B41J2/04541 , B41J2/04543 , B41J2/14016 , B41J2/14072 , B81B2201/05 , B81B2207/012 , B81B2207/091
Abstract: The present disclosure is directed to a microfluidic die that includes ejection circuitry and one time programmable memory with a minimal number of contact pads to external devices. The die includes a relatively large number of nozzles and a relatively small number of contact pads. The die includes decoding circuitry that utilizes the small number of contact pads to control the drive and ejection of the nozzles and the reading/writing of the memory with the same contact pads.
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公开(公告)号：US11146267B1
公开(公告)日：2021-10-12
申请号：US17106574
申请日：2020-11-30
Applicant: STMicroelectronics S.r.l.
Inventor： Franco Consiglieri , Pasquale Flora , Marco Zamprogno
IPC: H03B1/00 , H03K3/00 , H03K17/687 , G02B7/182
Abstract: A charge recovery driver is for a pair of loads, and includes first and second output nodes coupled to a pair of loads. During an initial phase, the first output node is grounded and the second output node is tied to the supply voltage. During a first phase, the first output node is coupled to the first tank capacitor and the second output node is coupled to the second tank capacitor. During a second phase, the first and second output nodes are coupled to one another. During a third phase, the second output node is coupled to the first tank capacitor and the first output node is coupled to the second tank capacitor. During a fourth phase, the first output node is coupled to the supply voltage and the second output node is coupled to ground. The third, second, and first phases are then repeated in that order.
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公开(公告)号：US20180050901A1
公开(公告)日：2018-02-22
申请号：US15240709
申请日：2016-08-18
Applicant: STMicroelectronics Asia Pacific Pte Ltd , STMicroelectronics S.r.l. , STMicroelectronics, Inc.
Inventor： Teck Khim Neo , Mauro Pasetti , Franco Consiglieri , Luca Molinari , Andrea Nicola Colecchia , Simon Dodd
CPC classification number: B81B7/008 , B05B1/24 , B05B17/06 , B41J2/04501 , B41J2/04541 , B41J2/04543 , B41J2/14016 , B41J2/14072 , B81B2201/05 , B81B2207/012 , B81B2207/091
Abstract: The present disclosure is directed to a microfluidic die that includes ejection circuitry and one time programmable memory with a minimal number of contact pads to external devices. The die includes a relatively large number of nozzles and a relatively small number of contact pads. The die includes decoding circuitry that utilizes the small number of contact pads to control the drive and ejection of the nozzles and the reading/writing of the memory with the same contact pads.
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